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1.
An air-injection press, which has holes punched in the heating plates, injects high-pressure air through the holes of one
plate into boards during press heating. The air-injection press can manufacture boards from high-moisture-content particles
by controlling blowouts of the boards. In this study, boards were manufactured from particles that had a moisture content
of 25% by using the air-injection press, which reduced the required pressing time. Boards manufactured by injecting air through
holes of 5 mm in diameter were of poor quality with a low internal bond strength of only 0.31 MPa. When the hole diameter
was reduced to 1 mm, the internal bond strength increased to 0.44 MPa. A high air-injection pressure of 0.55 MPa also resulted
in improved board properties over those for boards manufactured at lower pressures. This was probably because a large amount
of binder was released from boards through the 5-mm holes, together with water vapor, during air injection; the small-diameter
holes reduced the release of binder, resulting in better board properties. 相似文献
2.
Hideaki Korai Nan Ling Hiroshi Saotome Takahiko Iida Tomoko Hamano Kensuke Kawarada 《Journal of Wood Science》2012,58(3):216-221
An air-injection press, which has holes punched in the heating plates, injects high-pressure air through the holes of one plate into particleboards and discharges the air and vapor through the other plate during press heating. The press can manufacture particleboards from high-moisture particles by preventing blowouts of the boards. In this study, the effects of pressing temperature were investigated by pressing boards at 190, 210, and 230°C. The internal bond strength increased from 0.43 to 0.60?MPa by raising the temperature from 190 to 210°C, but did not increase further when the temperature was raised to 230°C. Raising the temperature from 190 to 210°C also helped improve the thickness swelling. No relationship was found between the modulus of rupture and pressing temperature. 相似文献
3.
Hideaki Korai Nan Ling Takayoshi Osada Osamu Yasuda Atsushi Sumida 《Journal of Wood Science》2011,57(5):401-407
An air-injection press was developed to prevent particleboard from blowing out during the manufacturing process. The air-injection
press, which has holes punched in the heating plates, injects high-pressure air into the board through the holes of one plate
and releases the air through the holes of the other plate. The high-pressure air forces out vapor trapped within the board,
thus preventing blowout. The newly developed press reduced the pressing time required for manufacturing board from high-moisture-content
particles. However, the manufactured boards exhibited mechanical properties and dimensional stability inferior to conventionally
manufactured boards. 相似文献
4.
Hiroshi Saotome Hideaki Korai Takahiko Iida Tomoko Hamano Kensuke Kawarada Masaharu Ohmi 《Journal of Wood Science》2012,58(5):423-428
An air-injection press (AIP) was developed to prevent accidental blowouts of boards during production. In this study, the effects of the AIP on preventing blowouts were investigated by artificially creating a blowout-prone condition, and the press was shown to be effective in preventing blowouts. The modulus of rupture of the boards was almost constant irrespective of pressing time. Longer pressing time resulted in higher internal bond strength when pressed at 170 °C. The thickness swelling of the boards pressed at 170 or 190 °C was almost uniform irrespective of pressing time, and the manufactured boards showed performance similar to those manufactured with an ordinary press. The AIP prevented blowouts sufficiently even when the pressure of the injected air was reduced, and this reduction did not adversely decrease the performance of the boards. Air injection reduced formaldehyde emissions from the board. 相似文献
5.
Particleboards of different densities (0.6, 0.7 and 0.8 g/cm3) and thicknesses (10 and 20 mm) were manufactured from low-moisture particles using an air-injection press. The effects of the air injection on preventing blowout of the boards of different densities and thicknesses were investigated by artificially creating blowout-prone conditions using metal frames. The effects of the air-injection pressure on the board performance were also investigated. 10-mm-thick boards of 0.8 g/cm3 pressed at 170 °C blew out when air was not injected, but were successfully manufactured by injecting air. 10-mm-thick boards at 150 °C showed constant internal bond (IB), regardless of density, but at 170 °C, IB was higher in boards of higher densities. This was likely due to accelerated hardening of the urea–formaldehyde resin at 170 than 150 °C. At both pressing temperatures, low air-injection pressure did not cause blowout and a reduction in board performance. Air injection also prevented the blowout of thick boards of 20 mm and enabled successful manufacture, showing its effectiveness. The IB of the 20-mm-thick board manufactured using the air-injection press exceeded that of 20-mm-thick board manufactured using an ordinary hot press. 相似文献
6.
A hot press was used to manufacture particleboards (H boards). A radio-frequency hot press (for RH boards) and an air-injection radio-frequency hot press (for ARH board) were also used, and the effects of air injection on preventing blowout and board properties were analyzed. The thicknesses and densities of manufactured boards were 10 and 30 mm, and 0.6, 0.7, and 0.8 g/cm3, respectively. The investigation ascertained the effects of air injection in preventing blowout when a radio-frequency hot press is used. The increasing order of temperature was ARH board > RH board > H board during the final pressing stage. For the 30-mm-thick boards, the temperature of H board increased to 100 °C and remained constant at 100 °C even when the pressing time was extended. The temperature of the RH board increased to 100 °C more quickly than in the case of the H board and remained constant at 110–118 °C. The temperature of the ARH board increased linearly to 130–142 °C. For both the 10- and 30-mm-thick boards, the internal bond strength of the RH board was almost the same as that of the ARH board at densities of 0.6 and 0.7 g/cm3. In contrast, the internal bond strength of the RH board was lower than that of the ARH board at a density of 0.8 g/cm3. For the 10-mm-thick boards, the thickness swelling in the RH board was almost the same as that in the ARH board irrespective of the density. However, for the 30-mm-thick boards, the thickness swelling in the RH board was higher than that in the ARH board. The low plasticization of particles due to air injection presumably results in a high degree of thickness swelling. 相似文献
7.
The development of a natural adhesive composed of materials derived from non-fossil resources is a very important issue. In this study, only citric acid and sucrose were used as adhesive materials for particleboard. A water solution in which citric acid and sucrose were dissolved was used as an adhesive, and the manufacture of particleboard with a target density of 0.8 g/cm3 was attempted under a press condition of 200 °C for 10 min. The optimum mixture ratio of citric acid and sucrose and the optimum resin content was 25–75 and 30 wt%, respectively. The modulus of rupture (MOR) and the modulus of elasticity in bending were 20.6 MPa and 4.6 GPa, respectively. The internal bond strength (IB) was 1.6 MPa, indicating that the adhesive had excellent bond strength. The thickness swelling (TS) after water immersion for 24 h at 20 °C was 11.9 %. The board did not decompose even under more severe accelerated treatments. This meant that the adhesion had good water resistance. The MOR, IB and TS of the board were comparable to or higher than the requirement of the 18 type of JIS A 5908 (2003). Consequently, there is a possibility that a mixture of citric acid and sucrose can be used as a natural adhesive for particleboard. 相似文献
8.
Particleboards with thickness of 10 mm and densities of 0.6, 0.7 and 0.8 g/cm3 were manufactured from high-moisture particles using urea–formaldehyde resin and the effectiveness of air injection was examined. The temperature in the 0.6 and 0.7 g/cm3 boards was lower with air injection than without during the initial to middle stages of pressing, while the temperature in the 0.8 g/cm3 board remained lower with air injection than without throughout the entire pressing process. Air injection reduced the pressing time required to manufacture the 0.6 and 0.7 g/cm3 boards and also increased the internal bond strength of boards of all densities. In the 0.6 and 0.7 g/cm3 boards, air injection reduced the modulus of rupture (MOR), while in the 0.8 g/cm3 boards, the MOR was similar between those manufactured by injecting and not injecting air. Air injection was also found to be effective for boards of high densities. The effectiveness of the air injection on thick boards was investigated by manufacturing 20-mm-thick boards of 0.7 g/cm3. Without air injection, it was not possible to manufacture the 20-mm-thick boards, even by extended hot pressing, but air injection allowed the boards to be manufactured by pressing for 16 min. Air injection was also shown to be effective for manufacturing thick boards. 相似文献
9.
Various types of wood-based boards were analyzed for deterioration after being exposed to an outdoor environment for 5 years in Tsukuba, Japan. In phenol–formaldehyde resin bonded particleboard (PB(PF)) and aspen oriented strand board (OSB(aspen)), longer exposure caused a greater reduction in the modulus of rupture and internal bond strength, an increase in the coefficients of variation, and a decrease in 95 % lower tolerance limit at the 75 % confidence level (95TL). Nail-head pull-through and lateral nail resistance were also reduced by outdoor exposure, but their coefficients of variation and 95TL were not significantly affected. In contrast, methylene diphenyl diisocyanate bonded medium density fiberboard (MDF(MDI)) only showed a slight deterioration of these properties even after 5-year exposure, and the coefficients of variation and 95TL hardly changed. After 5-year exposure, the retention of shear load in one-plane at relative displacement of 1.0 mm was high in MDF(MDI) and OSB(aspen) at 93.5 and 78.5 %, respectively, but low in PB(PF) at 41.1 %. As with PB(PF), OSB(aspen) also showed a sharp decrease in the modulus of rupture and internal bond strength, but only slightly reduced shear load in one-plane. 相似文献
10.
In this study, different properties of experimental particleboard produced using a sealed press were determined and were compared
with those for particleboard produced using a conventional press. Three types of binder, namely urea formaldehyde (UF), melamine
formaldehyde (MUF), and polymethylene diphenyl diisocyanate (PMDI), were used for board production. For the UF-bonded boards
produced using the sealed press, the modulus of rupture and the internal bond strength (IB) decreased due to the high temperature
and steam pressure used in comparison to the conditions in a conventional press. However, MUF- and PMDI-bonded boards had
improved IB and thickness swelling (TS). For the PMDI-bonded boards, especially, the TS was further improved and IB was increased
by using a sealed press. PMDI is known to possess superior properties and was confirmed to achieve good properties when used
as a binder for particleboards produced using a sealed press. 相似文献
11.
Tomy Listyanto Keisuke Ando Hidefumi Yamauchi Nobuaki Hattori 《Journal of Wood Science》2013,59(4):282-289
To investigate the effect of CO2 laser incising under five drying methods on drying characteristics of Sugi lumber, the squares (120 mm × 120 mm) of Sugi lumber with length of 650 mm were used. A half of samples were incised by CO2 laser with incising density of 2,500 holes/m2. Five types of drying methods were used: microwave drying, steam injection drying, and three combinations of microwave heating and steam injection drying. Steam injection drying was conducted by injecting superheated steam of 120 °C through a perforated plate heated to 140 °C of an injection press. Microwave was irradiated with the power of 3 kW at frequency of 2.45 GHz. The results indicated that incising helps heat through a specimen and thus the whole temperature raised rapidly, which was up to threefolds compared to that of no-incised one. Incised specimens dried by a combination of microwave heating for 1 h and steam injection showed the highest drying rate, which was up to 5.3 %/h. Incising and microwave heating contributed positively to dry lumber under more uniform distribution of moisture content and to reduce surface and internal checks. Incised specimen dried by microwave showed the most uniform distribution of moisture content without surface and internal checks. 相似文献
12.
In the face of dwindling fossil fuel resources and the environmental imperative to reduce emissions associated with petrochemistry, there is strong demand for a wood composite bonding procedure using natural alternatives. In this study, particleboards were manufactured with a new material adhesive composed of tannin and sucrose, and hot-pressed at 200 °C for 10 min, to a target density of 0.8 g/cm3. We found optimal values for the mat moisture content, the ratio of tannin to sucrose and the resin content of 3–6 wt%, 25/75 and 30–40 wt%, respectively. When the particleboards were manufactured under these optimum conditions, the modulus of rupture and the modulus of elasticity were in the range of 19.6–21.2 MPa and 4.6–5.0 GPa, respectively. The internal bond strength was in the range of 1.1–1.3 MPa. Based on these results, the mechanical properties of particleboard bonded with tannin and sucrose were higher than the requirements of the JIS A 5908 type 18 standard (2003). In the thickness swelling test (TS), the value was in the range of 20–23 %; as the ratio of sucrose and resin content increased, the TS value decreased. The reaction mechanism between tannin and sucrose was studied by fourier transform infrared spectroscopy, and the dimethylene ether bridges were observed. Consequently, it is possible that a tannin and sucrose mixture can be used as a natural adhesive for particleboard. 相似文献
13.
Phenol-formaldehyde resin-bonded particleboard (PF board) and isocyanate resin-bonded particleboard (MDI board) were soaked in water at 40, 70 and 100 °C, and the relationships between soaking conditions and nail joint properties were analyzed. The soaking time to reach the lower limit of nail-head pull-through (NHPT) of the PF board was 2 h at 100 °C, while it took 168 h at 70 °C. The soaking time to reach the lower limit of lateral nail resistance (LNR) of the PF board was 24 h at 100 °C, but it did not take 168 h at 70 °C to reach it. The lower limits of NHPT and LNR for the MDI board were higher than those for the PF board. For the PF board, there was a high correlation between modulus of rupture, internal bond strength and nail joint properties. Based on the results of water soaking and outdoor exposure, it was shown that thickness change has a significant effect on NHPT and LNR, and that the reduction in NHPT and LNR results from the collapse of bonding points owing to swelling of the board. 相似文献
14.
15.
The deterioration of particleboards for construction use was investigated by outdoor exposure tests at eight sites in Japan over 7 years. Two types of particleboard with different water resistances were tested and the deterioration of mechanical properties such as modulus of rupture, internal bond strength and lateral nail resistance was investigated. In order to eliminate regional differences in the board deterioration and also to standardize a deterioration factor for the board exposed to varying climate conditions, we introduced the weathering intensity (WI) defined by monthly precipitation multiplied by monthly average temperature. The significance of this factor was investigated by correlation analysis. Three conventional climate indexes relevant to the durability of wood were also investigated to analyze their significance to WI for particleboard deterioration. It was found that our definition of weathering intensity was the most accurate and the exposure period that reduces initial bending strength by half was calculated by the use of regression analysis for several different sites worldwide. 相似文献
16.
The effectiveness of air injection for preventing the blowout of particleboards manufactured using a radio-frequency hot press was investigated by evaluating the board properties under artificially created conditions that were conducive to blowout. For evaluation, 10-mm-thick boards with densities of 0.7 and 0.8 g/cm3 and 20-mm-thick boards with a density of 0.7 g/cm3 were manufactured. Pressing times for the 10-mm-thick boards were 2, 4, 6, and 8 min, and those for the 20-mm-thick boards were 4, 6, 8, and 10 min. Without air injection, blowout occurred in all manufactured boards. With air injection, however, blowout did not occur in the 10-mm-thick boards with a density of 0.7 g/cm3. Moreover, air injection prevented blowout even when the board density and board thickness were increased to 0.8 g/cm3 (for 10-mm-thick boards) and 20 mm (the density was kept at 0.7 g/cm3), respectively. Air-injection radio-frequency pressing reduced the pressing time from 4 to 2 min for 10-mm-thick boards, and from 6 to 4 min for 20-mm-thick boards. Moreover, this reduction in the pressing time was achieved without a large reduction in the internal bond strength of the boards. 相似文献
17.
This paper describes the features of binderless particleboard manufactured from sugarcane bagasse, under a high pressing temperature of 200–280 °C. Mechanical properties [i.e., modulus of rupture (MOR) and elasticity (MOE) in dry and wet conditions, internal bonding strength (IB)] and dimensional stability [i.e., thickness swelling (TS)] of the board were evaluated to investigate the effect of high pressing temperature. Recycled chip binderless particleboards were manufactured under the same conditions for comparison, and particleboards bonded with polymeric methylene diphenyl diisocyanate (PMDI) resin were manufactured as reference material. The target density was 0.8 g/cm3 for all of the boards. The results showed that the mechanical properties and dimensional stability of both types of binderless boards were improved by increasing the pressing temperature. Bagasse showed better performance than that of recycled chip as a raw material in all evaluations. Bagasse binderless particleboard manufactured at 260 °C had an MOE value of 3.5 GPa, which was equivalent to the PMDI particleboard, and a lower TS value of 3.7 % than that of PMDI particleboard. The MOR retention ratio under the dry and wet conditions was 87.0 %, while the ratio for the PMDI particleboard was only 54.6 %. The obtained results showed the possibility of manufacturing high-durability binderless particleboard, with good dimensional stability and water resistance, which previously were points of weakness for binderless boards. Manufacturing binderless boards under high temperature was effective even when using particles with poor contact area, and it was possible to express acceptable properties to allow the manufacture of particleboards. Further chemical analysis indicated a contribution of a saccharide in the bagasse to the improvement of the board properties. 相似文献
18.
19.
This paper details the influence of the length and content of polypropylene (PP) fibers on the physical and mechanical properties of gypsum particleboard (GPB). The length and amount of PP fibers added had a significant effect on the internal bond strength (IB) and the modulus of rupture (MOR) of GPB. The highest IB value was shown at 9 mm length and 9% content of PP fibers. The MOR was highest when the board was made with PP of 12 mm fiber length and 12% content. Suitable contents of PP fibers were advantageous in that they reinforced the properties of GPB so it achieved high performance. In contrast, a high content of PP fibers reduced the IB, MOR, and modulus of elasticity (MOE) of GPB. The thickness swelling was reduced with an increase in PP length and content. It was concluded that the combination of 12 mm length and 12% content or 3mm length and 9% content was optimum for producing good performance of GPB.Part of this paper was presented at the 50th Annual Meeting of the Japan Wood Research Society, Kyoto, April 2000 相似文献