|
|||||
|
|
Research on Error Automatic Revised Method of LSI Wafer Honing Process |
|
| Authors: | Guo Yinbiao Yang Jidong Xu Yazhen Liang Xichuang Katuo Syoji |
| Abstract: | A new automatic revised method of wafer profile error which uses CCD measuring error,sets up machining data base and carries out a wedge structure for stepless compensating error in honing process is described.Using this technology,a high precision LSI wafers can be obtained. |
| Keywords: | concave convex wafers CCD measuring automatic revised honing |
| 点击此处可从《保鲜与加工》浏览原始摘要信息 | |
| 点击此处可从《保鲜与加工》下载免费的PDF全文 | |