The effects of temperature and humidity on phenol-formaldehyde resin bonding

Summary The effects of temperature and relative humidity on phenol-formaldehyde resin bonding were evaluated. Two flakes in a lap-shear configuration were bonded under an environment of controlled temperature (110 °C, 120 °C, 130 °C, 140 °C) and relative humidity (41%, 75%, 90%) for a series of time periods (0.25 to 16 min). The lap-shear specimens were then shear-tested on a mechanical testing machine and the results were used to establish a family of bond strength development curves at each temperature and level of relative humidity. At 110°C, the higher relative humidity appeared to retard resin bonding. The effects of relative humidity diminished as temperature increased to 140 °C. Bond strength development was chemical ratecontrolled. The rate of bond strength development at each relative humidity follows a first order reaction mechanism. The activation energy of resin-wood bonding, determined by bonding kinetics, was higher than that of resin alone, determined by differential scanning calorimetry. This comparison indicates that to form a strong resin-wood bond, a higher energy level might be required.This material is based on work supported by the Ministry of International Affairs, Quebec Government, the Natural Sciences and Engineering Research Council of Canada, and Laval University (Quebec City). The work was also supported by the U.S. Department of Agriculture under research joint venture agreement FP-92-1835