| 硅和玻璃阳极键合 |
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| 引用本文： | 刘子建,赵轩,王小安. 硅和玻璃阳极键合[J]. 山东饲料, 2012, 0(9): 104+311 |
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| 作者姓名： | 刘子建 赵轩 王小安 |
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| 作者单位： | 辽宁工程职业学院 |
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| 摘 要： | 本文叙述了硅与玻璃阳极键合实验过程,对其结合面进行了扫描电镜(SEM)和能谱分析表明离子迁移和阳极氧化是实现键合的关键,其结合机理为电化学反应。
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| 关 键 词： | 硅与玻璃 阳极键合 电化学反应 |
Anodic Bonding Between Silicon and Glass Aluminum |
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| LIU Zi-jian,ZHAO Xuan,WANG Xiao-an. Anodic Bonding Between Silicon and Glass Aluminum[J]. , 2012, 0(9): 104+311 |
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| Authors: | LIU Zi-jian ZHAO Xuan WANG Xiao-an |
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| Affiliation: | (Liaoning Engineering Vocational College Tieling 112000 China) |
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| Abstract: | In this paper,The experiment of anodic bonding between silicon and glass is introduced,the bonded interfaces was studied by SEM and EDS,showed that the ion mobility and the anodic oxidation is the key to the bonding,the bonding mechanism is the electrochemical reaction. |
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| Keywords: | Silicon and glass Anodic bonding Electrochemical reaction |
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