|
|||||
|
|
Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model application |
|
| Authors: | Ling Li Meng Gong Y. H. Chui Ying Liu |
| Affiliation: | 1. Wood Science and Technology Centre, University of New Brunswick, 1350 Regent Street, Fredericton, NB, E3C 2G6, Canada 2. College of Mechanical and Electrical Engineering, Nanjing Forestry University, 159 Longpan Rd, Xuanwu, Nanjing, Jiangsu, China |
| Abstract: | |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ | |