超声复合线锯锯切单晶硅的温度场仿真分析

单晶硅是一种硬脆性材料,采用超声复合工艺加工可以有效提高单晶硅的加工效率和质量.在超声复合工艺线锯锯切单晶硅的过程中,锯切温度场的分布影响单晶硅片表面质量.鉴于此,从锯切温度入手,分析超声复合工艺线锯锯切单晶硅的原理,建立仿真模型,充分考虑发热机理和各种散热条件,利用仿真软件ABAQUS对锯切单晶硅的过程进行热瞬态分析...

Simulation Analysis of Temperature Field in Cutting Monocrystalline Silicon with Ultrasonic Vibration-assisted Diamond Wire Saw

As a hard-brittle material,monocrystalline silicon can be processed more efficiently and with higher machined surface quality by adopting the ultrasonic vibration-assisted diamond wire saw.In the process of cutting monocrystalline silicon,the distribution of cutting temperature field affects the machined surface quality.This paper first analyzes the processing principle of the ultrasonic vibration-assisted diamond wire sawing,and then set up the simulation model.By fully considering the heating mechanism and various heat dissipation conditions,conduct thermal transient analysis on the sawing process with simulation software,and analyze the maximum temperature and the change curve of sawing under different parameters(linear speed,feed speed,workpiece rotational speed,and ultrasonic amplitude).This paper provides a theoretical reference for studying the machining mechanism of the ultrasonic vibration-assisted diamond wire sawing.