Preparation of Epoxy Shape Memory Polymers for Deployable Space Structures Using Flexible Diamines

In order to develop epoxy shape memory polymers (ESMPs) with high switching temperature and excellent toughness for deployable space structures, the crosslink density and chain flexibility of candidate ESMP samples were tunned by adding two flexible poly(oxypropylene) diamines, Jeffamine D-230 (D230) and Jeffamine D-400 (D400), as a secondary curing agent. The desired switching temperature of ESMPs for deployable space structures was set within the range of 120-135°C. By adding D230 and D400, the switching temperature of the ESMPs could be adjusted to within this range by increasing their crosslink density, and their impact strength could be significantly increased due to the stress relaxation properties of the diamines’ flexible molecular chains. The modulus and tensile strength of the ESMPs increased, but elongation at break decreased, in proportion to the diamine content. The ESMPs with a suitable switching temperature for deployable space structures had a high elongation at break greater than 22 % and good shape recovery and shape fixity ratios. The larger the value of shape recovery ratio, the faster the shape recovery speed.