| 基于虚拟机技术和有限元分析的键合机机械结构与系统动态性能分析 |
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| 引用本文： | 张维. 基于虚拟机技术和有限元分析的键合机机械结构与系统动态性能分析[J]. 西南大学学报(自然科学版), 2011, 33(5) |
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| 作者姓名： | 张维 |
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| 作者单位： | 哈尔滨工业大学控制科学与工程系; |
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| 摘 要： | 随着半导体制造技术不断向微细化、高速、高密度方向发展,开发高精度、高效率、高可靠性的键合机是对封装设备制造业刻不容缓的要求.而深入认识、分析和改善键合机的机械结构与性能成为广大科研工作者面临的首要任务.利用虚拟机技术软件(ADAMS)建立了某键合机的动力学模型,并通过仿真验证了模型的正确性;利用有限元分析软件(PANTRAN)分析了该键合机中关键部件的物性特性对整机精度的影响,并得出初步的结论.
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| 关 键 词： | 键合机 虚拟机技术 有限元分析 |
Analysis of the Mechanical Structure and Dynamic Performance of the Wire Bonder Based on Virtual Technology and Finite Element Analysis |
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| ZHANG Wei Control Sciencl , Engineering,Harbin Institute of Technology,Harbin ,China. Analysis of the Mechanical Structure and Dynamic Performance of the Wire Bonder Based on Virtual Technology and Finite Element Analysis[J]. Journal of southwest university (Natural science edition), 2011, 33(5) |
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| Authors: | ZHANG Wei Control Sciencl Engineering Harbin Institute of Technology Harbin China |
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| Affiliation: | ZHANG Wei Control Sciencl and Engineering,Harbin Institute of Technology,Harbin 150001,China |
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| Abstract: | As semiconductor manufacturing technology constantly develops in the direction of micronization,high-speed and high-density,the invention and innovation of highly precise,efficient and reliable wire bonders is an imperative requirement for packaging manufacturing.Therefore,the in-depth understanding,analysis and improvement of the mechanical structure and dynamical performance of the wire bonders have become the prior task for numerous scientific researchers.In this paper,a dynamical model of a certain wire... |
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| Keywords: | wire bonder virtual technology finite element analysis |
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