Lateral growth of a wheat dough disk under various growth conditions |
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Authors: | Amy Penner Leaelaf Hailemariam Martin Okos Osvaldo Campanella |
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Institution: | 1. School of Agricultural and Biological Engineering, Purdue University, West Lafayette, IN 47907-2093, USA;2. School of Chemical Engineering, Purdue University, West Lafayette, IN 47907-2100, USA |
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Abstract: | Numerous studies have tried to understand and model bubble growth inside dough. Experimental studies are inconvenienced by the methods’ inability to capture the dynamic phenomena. In this paper, a versatile experimental method was developed to allow for macroscopic expansion of wheat dough. The study evaluates expansion of a dough disk under varying: moisture content (40, 41, 42, 43, and 44% wb), leavening acid concentration (30, 40, and 50% db), pressure schemas, pressurizing gas (compressed air and CO2), and lubrication (Teflon® film coating and Pam® aerosol lubricant). Dough expansion increased 22.6% by increasing moisture content from 40 to 44%. Increased baking powder formulation (40% db) was used to enhance initial growth conditions and CO2 production. ‘Pressure pulse’ and ‘pressure vacuum methods’ added pressurization alternatively with full vacuum. The former method included a rest period before vacuum application, and increased expansion by 10.8%. Teflon® and Pam® reduced friction between the dough and acrylic plate and increased the final expansion by 14.7% compared to no lubricant following the ‘standard pressurization method’. ‘Pressure pulse’ and ‘pressure vacuum’ experiments decreased expansion by 28.4 and 38.2%, respectively compared to ‘standard pressurization’ while using Teflon® and Pam®. |
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Keywords: | Viscoelasticity Dough Pressure release Expansion |
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