Stress relaxation of wood during elevating and lowering processes of temperature and the set after relaxation II: consideration of the mechanism and simulation of stress relaxation behavior using a viscoelastic model

Previously we showed that the relaxation modulusEt of water-saturated wood during temperature reduction maintained its initial value despite the decrease in temperature, although during temperature elevationEt showed a marked decrease. In the present study, to clarify the mechanism of relaxation during temperature elevation and reduction, Young's modulus was measured in stress relaxation experiments with changes in temperature, and relaxation behavior was simulated using a Maxwell model consisting of five elements. Furthermore, the dynamic Young's modulus and dynamic loss modulus were measured during both temperature elevation and reduction. The results obtained suggested that the unique relaxation behavior during temperature reduction was caused by decreases in Young's modulus and coefficient of viscosity (i.e., an increase in fluidity) compared with those during elevation of temperature. The decrease in Young's modulus and increase in fluidity were considered to be due to an unstable structure in wood that occurred during temperature reduction. This unstable structure probably develops in the nonequilibrium state of temperature toward a true equilibrium state. Wood should be more unstable during temperature reduction than during temperature elevation because of the decrease in molecular motion when the temperature is lowered.Part of this report was presented at the 49th annual meeting of the Japan Wood Research Society, Tokyo, April 1999