Adhesive penetration in beech wood: experiments

A study with synchrotron radiation X-ray tomographic microscopy (SRXTM) of PUR, PVAc, and UF adhesive bond lines in beech wood, bonded under various growth ring angles, is presented. The bond line morphologies and the adhesive penetration into the wood structure were evaluated after determining the hardening characteristics of the adhesives. Distinct bond line imperfections were found for the different adhesive systems. To describe the adhesive distribution inside the bond line, the saturation of the pore space instead of the commonly used maximum penetration depth seems to be adequate.