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Fatigue in wood-based panels. Part 1: The strength variability and fatigue performance of OSB, chipboard and MDF
Authors:R. J. H. Thompson  M. P. Ansell  P. W. Bonfield  J. M. Dinwoodie
Affiliation:(1) Centre for Timber Technology and Construction Building Research Establishment Garston, Watford, WD25 9XX, UK e-mail: thompson@lore.co.uk, GB;(2) Department of Materials Science and Engineering, Faculty of Engineering and Design, University of Bath, Bath, Avon, BA2 7AY, UK, GB;(3) Centre for Timber Technology and Construction, Building Research Establishment, Garston, Watford, WD2 7JR, UK, GB
Abstract:Wood-based panels used as floor decking can be exposed to fatigue as well as creep loading. The strength and fatigue performances of three wood-based panel products OSB, chipboard and MDF have been determined in four-point bending. The mean bending strengths were found to decrease in the following order MDF>OSB>chipboard. The bending strength variation within the OSB was considerably greater than that for chipboard and MDF. Normalised with respect to the static strengths, the fatigue performance of the chipboard was superior to that of the OSB, although the two materials have very similar performances at low stress levels. Normalised with respect to the static strengths, the fatigue performance of the MDF was inferior to both materials and at lower stress levels the fatigue performance deteriorated to a greater extent. However, in terms of absolute applied stress, the fatigue performance of the MDF was superior to that of the OSB, which was superior to that of the chipboard. However, as the stress was reduced the difference between the three materials reduced. At low stresses the performances of the three materials were quite similar. Received 5 August 1999
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