首页 | 本学科首页   官方微博 | 高级检索  
     检索      

套作模式下链环式覆土器的参数优化
引用本文:苟 文,马荣朝,樊高琼,杨文钰,刘 琳,雷小龙.套作模式下链环式覆土器的参数优化[J].农业工程学报,2011,27(12):33-37.
作者姓名:苟 文  马荣朝  樊高琼  杨文钰  刘 琳  雷小龙
作者单位:四川农业大学信息与工程技术学院,四川雅安,625014
基金项目:四川省教育厅青年基金项目(套作小麦机械化栽培技术及机理研究);四川主要粮食作物丰产高效技术集成研究与示范;突破性作物新品种高产高效栽培技术研究(2006YZGG-28)。
摘    要:针对在西南丘陵地区使用小麦免耕直播机播种时的覆土要求,采用中心组合试验设计方法进行链环式覆土器的机播试验,建立了覆土合格率与外径、链环厚度、链环宽度的数学模型,并采用响应面优化分析,得到了链环式覆土器的最佳结构参数.结果证明:当外径为150 mm、链环厚度为9mm、链环宽度为16mm的较优参数组合时,覆土合格率达98.07%.实践证明该优化方案可行,为西南地区小麦直播机的改进设计提供了理论依据.

关 键 词:农业机械  模型  优化  套作模式  链环式覆土器  响应面法
收稿时间:3/9/2011 12:00:00 AM
修稿时间:2011/4/14 0:00:00

Parameter optimization of interlink covering device in relay-cropping system
Gou Wen,Ma Rongchao,Fan Gaoqiong,Yang Wenyu,Liu Lin and Lei Xiaolong.Parameter optimization of interlink covering device in relay-cropping system[J].Transactions of the Chinese Society of Agricultural Engineering,2011,27(12):33-37.
Authors:Gou Wen  Ma Rongchao  Fan Gaoqiong  Yang Wenyu  Liu Lin and Lei Xiaolong
Abstract:In view of the soil covering demand when wheat no-tillage seeder seed wheat in the hilly area of southwest, the experiment about wheat seeding of interlink covering device was carried out with central composite experiment design. Meanwhile, the mathematical model between covering acceptability and external diameter, serial thickness, serial width was established. The optimal structure parameters of interlink covering device were obtained by response surface analysis. The results indicated that the covering acceptability reached 98.07% when the external diameter was 150 mm, and the serial thickness and width were 9 and 16mm respectively. The practice shows that the optimization scheme is feasible and provides a theoretical basis for the improved design of wheat no-tillage seeder in the southwest region.
Keywords:agricultural machinery  models  optimization  relay-cropping system  interlink covering device  response surface methodology
本文献已被 CNKI 万方数据 等数据库收录!
点击此处可从《农业工程学报》浏览原始摘要信息
点击此处可从《农业工程学报》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号