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Acoustic emission patterns from the surfaces of red oak wafers under transverse bending stress
Authors:R W Rice  Ch Skaar
Institution:(1) Mississippi Forest Products Utilization Laboratory, 39762 Mississippi State, MS, USA;(2) Department of Wood Science and Forest Products, Virginia Polytechnic Institute, 24061 Blacksburg, VA, USA
Abstract:Summary One of the applications of acoustic emission (AE) technology in the forest products field is likely to be in monitoring and/or controlling the drying of wood. This report describes experiments designed to monitor the acoustic emission patterns from the lower surfaces of small red oak test beams which were undergoing failure in tension perpendicular to the grain. Similar patterns are likely to develop in wood which surface checks during drying.When the wood was green, the emission patterns from beams under test were well defined and could be used to predict the onset of cracking before the surfaces under tension were visibly cracked. These patterns were quite similar to the acoustic response of brittle, glassy polymers under stress. Additional experiments on partially dried test beams showed that the clearly predictable emission patterns disappeared and the general level of acoustic emissions increased. This increase in emissions may correspond to shrinkage, at the cell level, of the partially dried beams.This research was conducted as part of the first authors Ph.D. program at VPI&SU under CSRS project 3333121. The author gratefully acknowledges the support of the U.S.D.A. Eastern Hardwoods Utilization Program
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