Manufacture and properties of low-density binderless particleboard from kenaf core

Low-density binderless particleboards from kenaf core were successfully developed using steam injection pressing. The target board density ranged from 0.10 to 0.30g/cm³, the steam pressure used was 1.0MPa, and the steam treatment times were 7 and 10min. The mechanical properties, dimensional stability, and thermal and sound insulation performances of the boards were investigated. The results showed that the low-density kenaf binderless particleboards had good mechanical properties and dimensional stability relative to their low board densities. The board of 0.20g/cm³ density with a 10-min treatment time produced the following values: modulus of rupture 1.1MPa, modulus of elasticity 0.3GPa, internal bond strength 0.10MPa, thickness swelling in 24h water immersion 6.6%, and water absorption 355%. The thermal conductivity of the low-density kenaf binderless particleboards showed values similar to those of insulation material (i.e., rock wool), and the sound absorption coefficient was high. In addition, the boards are free from formaldehyde emission. Kenaf core appears to be a potential raw material for low-density binderless panels suitable for sound absorption and thermally resistant interior products.Part of this report was presented at the 52th Annual Meeting of the Japan Wood Research Society, Gifu, Japan, April 2002