竹大片刨花切削条件的研究

以云南屏边县产龙竹和苦竹为原料，研究刨片机的刀门间隙、切削角、切削速度对竹大片刨花质量的影响。刨花平整度和刨花厚芳偏差为衡量刨花后质量指标，通过系列化 多因素正交试验，不仅确定了竹大片刨花最佳质量，而且确定了获取最佳质量刨花的最佳切削条件。

Wafering Conditions for Bamboo based Wafer

Since quality of wafer is one of the most critical factors to affect final quality of bamboo based waferboard, it is necessary to investigate main wafering factors affecting wafer quality, such as knife gap, cutting angle and cutting speed. Experimental testing results on bamboo species Dendrocalamus giganteus and Pleioblastus amarus with flatness and thickness deviation as quality indicators determined the best quality of the wafer, as well as the optimum wafering conditions through a series of single factor experiments and multi factor orthogonal experiments.