Wafer-scale graphene integrated circuit

A wafer-scale graphene circuit was demonstrated in which all circuit components, including graphene field-effect transistor and inductors, were monolithically integrated on a single silicon carbide wafer. The integrated circuit operates as a broadband radio-frequency mixer at frequencies up to 10 gigahertz. These graphene circuits exhibit outstanding thermal stability with little reduction in performance (less than 1 decibel) between 300 and 400 kelvin. These results open up possibilities of achieving practical graphene technology with more complex functionality and performance.     

Fate of Dwarf Bunt Fungus Teliospores During Milling of Wheat into Flour

Wheat contaminated with teliospores of Tilletia controversa Kühn (TCK) was mixed with uncontaminated wheat and processed through the Kansas State University pilot mill. Two 50-bu lots of the contaminated mixture were cleaned, tempered, and milled. Approximately 500 samples of wheat, cleanings, and mill fractions were collected and examined for the presence of intact and broken TCK teliospores. Whole wheat samples (50 g) were washed, sieved through a 60-μm nylon sieve, and pelleted by centrifugation. Contents of the pellet were examined microscopically for the presence of TCK spores. The procedure was modified as needed to accommodate cleanings and mill fractions. Levels of spore contamination in whole wheat samples decreased at each step during the handling process, and large numbers of spores were found in materials that were sieved or aspirated from the grain. Very few spores were found in bran, germ, and shorts; none were detected in red dog or straight-grade flour. The results showed that a high percentage of spores can be removed from wheat by mechanical cleaning but that it is not feasible to remove all of them.