油用型红花(Carthamus tinctoris L.)种子醇溶蛋白遗传多样性分析

利用A-PAGE（Acid-polyacrylamide gel electrophoresis）技术对来源于不同国家的79份油用型红花材料醇溶蛋白位点进行检测。结果表明，油用型红花醇溶蛋白位点存在丰富的变异类型，共分离出15条迁移率不同的谱带，每份材料具有3—12条不等，平均8．5条。材料间平均遗传相似系数（GS）为0．5303，变幅为0．1333—1．000，且各洲间遗传多样性大于洲内遗传多样性。在GS值为0．512的水平上，供试材料聚为六大类，聚类结果表明，红花醇溶蛋白图谱类型与其地理分布有一定的相关，但不显著。     

不溶性胞壁结合酚类物质在棉花对枯萎病抗性中的作用

分析了枯萎病菌侵染后棉花叶片和根茎部组织中不溶性胞壁结合酚类物质 (胞壁结合的简单酚、复杂酚聚合物及黄酮醇 )含量的变化。结果表明 ,抗病品种棉苗中不溶性胞壁结合酚类物质含量高于感病品种 ,同一品种内根茎部组织中含量较高 ;氟乐灵播前土壤处理可诱发棉苗产生对枯萎病的诱导抗性 ,同时也促进了棉苗组织中不溶性胞壁结合酚类物质的积累 ;枯萎病菌侵染后棉苗组织中不溶性胞壁结合酚类物质含量明显增加 ,抗病品种棉苗和经氟乐灵处理的棉苗受侵后不溶性胞壁结合酚类物质含量的增加分别大于感病品种棉苗和未经氟乐灵处理棉苗中的增加水平。这些结果说明 ,不溶性胞壁结合酚类物质在棉花对枯萎病的抗性及由氟乐灵诱发的诱导抗性中起作用     

玉米优良杂交种豫玉22产量性状的遗传分析

以玉米优良杂交种豫玉22的F2∶3家系为材料,通过一年两点的田间试验，研究其产量性状的遗传特征，以期为提高玉米产量杂种优势的利用水平提供有益信息。结果表明,在8个穗部产量性状中，广义遗传力较高的为行数、穗长、出籽率、穗粗；在F1代和F2∶3家系中，杂种优势强的性状是穗粒重、行粒数、穗长，较弱的是出籽率和百粒重；     

高产优质多抗玉米杂交种黔单20号制种技术

根据黔单20号亲本在贵州山区生态条件下的特征特性以及制种过程中的产量表现，总结出该品种的制种经验，为我省及周边地区该品种制种提供参考。     

限水条件下氮肥用量及施氮时期对冬小麦产量、土壤硝态氮含量的影响

在节水栽培条件下,研究了不同施氮量及氮肥施用时期对冬小麦产量、生育期间土壤硝态氮含量的影响。结果表明,冬小麦施氮处理产量均高于N0,N88.5 69处理产量最高,氮肥生理效率则随施氮量增加而显著降低。开花期以及成熟期各施氮处理0~100 cm土体硝态氮含量均明显高于N0,各生育期0~60 cm土层硝态氮含量均随施氮量增加而增加,开花期各处理2 m土体硝态氮含量达到最高值,成熟期20~60 cm土层相同施氮量(157.5,226.5kg/hm2)均表现为氮肥分次施用处理硝态氮含量高于一次性底施处理(N88.5 69>N157.5,N123 103.5>N226.5)。成熟期土壤硝态氮2 m土体累积量随施氮量增加显著增加,且等量氮肥分次施用显著高于一次性底施。     

回交高代选择导入系的纹枯病抗性与抗旱性的遗传重叠研究

利用来自抗旱性较好的供体亲本（BG300和BG304）、具有两种遗传背景（IR64和特青）的水稻高代回交（BC2）抗旱选择导入系，通过人工接种的方法鉴定纹枯病抗性，考察纹枯病抗性与抗旱性之间可能存在的遗传重叠。通过与受体亲本的纹枯病抗性表现比较发现，具有特青背景的抗旱选择导入系倾向于纹枯病抗性的降低，而IR64背景的抗旱选择导入系则倾向于纹枯病抗性的增强。基于基因型与表型的方差分析共鉴定到6个与纹枯病抗性相关的位点，其中QSbr6在不同供体和背景的两个群体中分别检测到，而QSbr10则在同一供体的两个遗传背景下均检测到；有3个位点（QSbr6、QSbr8和QSbr10）与同一群体中检测到的抗旱性位点位置相近，很可能是两种抗性重叠的遗传基础。尽管方差分析的方法在选择导入系的非选择目标性状相关位点的鉴定中存在相当程度的偏低估计，本研究所检测到的纹枯病抗性位点，特别是那些与抗旱性重叠位点的分子标记以及相关的抗性株系仍将为进一步的水稻纹枯病抗性和抗旱性的多抗性育种和深入的遗传重叠研究提供有用的信息和材料。     

Numerical Simulation of Elastoplastic Multi-scales Model for Magnesium Alloy Under Tensile Load

In order to investigate the macroscopical mechanical performance of magnesium alloy material containing pore and the mechanism during distorting destructing, an accurate finite element model of magnesium alloy using the multiscales method was developed, and the macroscopic properties of material under the macroscopic tensile load using the developed constitutive model of multi-scales and finite element method was obtained. By analyzing the distortion results of meso-model through the multi-scales method, with macroscopical load increasing, the difference demonstrated on the macroscopic is very small, however, with the increase of the load step, the phenomenon that the ability of plasticity deformation of the meso-models which includes the cuboid pore decreased gradually remarkable and the phenomenon of stress centralized is more severity than the meso-models including cylindrical pore could be obviously observed during the process of deformation on the meso-models.     

黄瓜涂膜保鲜研究

通过试验确定了黄瓜复合涂膜液的最佳配比:蔗糖脂肪酸酯3.75%,海藻酸钠0.5%,可溶性淀粉6.5%,甘油1%,苯甲酸钠0.1%。用此复合涂膜液在40℃浸泡黄瓜2min,自然风干后置室温下贮藏,可明显延长黄瓜的货架寿命。     

Numerical Analysis of Spiral Notch-holes Loosen Blasting

ANSYS program is applied to the numerical analysis on the space flexibility and elastoplasticity of a spiral(V-notch),which suggests that: 1)The stress distribution is uneven inside the spiral V-notch as tensile stress is focused near the tip of the notch.2)Tensile stress and compressive stress areas are located alternatively inside the whole notch,the stress changes slower at a point farther from a crack tip,and much faster at a nearer point.3)Elastoplasticity study finds that there exists at the tip of the crack a plastic zone that expand and extend to the direction of the tip with increase load so that cracks initiate at the tip of the notch and extend in the direction of the tip.     

Application of SDL in the Digital System Design

As a standardized formal language, the SDL has widely been used in the software development. In order to extend its application field, it has been explored to use in hardware design.This paper gives a logical gate circuit-and gate as an example to explain the method of applying SDL to describe and simulate/validate the hardware characters by the SDT tool. The various logic circuits or digital circuits may be made to the SDL packages because the SDL supports the object oriented technology. These packages can be directly invoked in the design of the complex digital system, so it is possible to describe and simulate/validate the complex digital system.The experiment has proved that the application of SDL for hardware design is feasible and rather convenient.