Characterization of bagasse binderless particleboard manufactured in high-temperature range

This paper describes the features of binderless particleboard manufactured from sugarcane bagasse, under a high pressing temperature of 200–280 °C. Mechanical properties [i.e., modulus of rupture (MOR) and elasticity (MOE) in dry and wet conditions, internal bonding strength (IB)] and dimensional stability [i.e., thickness swelling (TS)] of the board were evaluated to investigate the effect of high pressing temperature. Recycled chip binderless particleboards were manufactured under the same conditions for comparison, and particleboards bonded with polymeric methylene diphenyl diisocyanate (PMDI) resin were manufactured as reference material. The target density was 0.8 g/cm³ for all of the boards. The results showed that the mechanical properties and dimensional stability of both types of binderless boards were improved by increasing the pressing temperature. Bagasse showed better performance than that of recycled chip as a raw material in all evaluations. Bagasse binderless particleboard manufactured at 260 °C had an MOE value of 3.5 GPa, which was equivalent to the PMDI particleboard, and a lower TS value of 3.7 % than that of PMDI particleboard. The MOR retention ratio under the dry and wet conditions was 87.0 %, while the ratio for the PMDI particleboard was only 54.6 %. The obtained results showed the possibility of manufacturing high-durability binderless particleboard, with good dimensional stability and water resistance, which previously were points of weakness for binderless boards. Manufacturing binderless boards under high temperature was effective even when using particles with poor contact area, and it was possible to express acceptable properties to allow the manufacture of particleboards. Further chemical analysis indicated a contribution of a saccharide in the bagasse to the improvement of the board properties.     

Chemical changes in steam-pressed kenaf core binderless particleboard

The effects of chemical changes in kenaf core binderless particleboards on the bonding performance and thickness swelling of boards were investigated by chemical and spectroscopic analyses. Mild steam-injection treatments (0.6–1.0MPa) caused significant degradation of hemicelluloses, lignin, and cellulose. Conventional hot pressing caused a lower degree of degradation of the chemical components. The hot-pressed kenaf core board without any binders showed poor bonding performance. Thus, it was found that partial degradation of the three major chemical components of the kenaf core by mild steam-injection treatment increased the bonding performance and dimensional stability of the binderless boards, and gave better quality binderless boards than those made by hot-pressing treatments.Part of this report was presented at the 4th International Wood Science Symposium, Serpong, Indonesia, September 2002; and at the 53rd Annual Meeting of The Japan Wood Research Society, Fukuoka, March 2003     

Recent research and development work on wood composites in Japan

Summary This paper highlights a number of articles on research and development on wood composites. The coefficient of variation in the mechanical properties of wood components tends to decrease when the thickness of the wood elements decreases. This finding was utilized in the manufacture of hollow cylindrical columns of laminated veneer lumber (LVL) from Cryptomeria plantation thinnings. In the future, the marketing of wood composite boards will tend toward two types: thick boards with low density properties and thin boards with fiber orientation. For the production of thick boards, fundamental parameters and application of steam-injection pressing have been studied, and continuous steam-injection pressing has been developed. For thin board production, generation principles of aligning torque in high-voltage system and the application has been studied. A new oriented mat former with electrodes positioned only at the reverse side of a forming belt has been developed. Various synthetic resins of low-molecular weight have been applied to improve dimensional stability of laminated products, such as LVLs and particleboards. Acetylation and formalyzation of fibers and particles were investigated to provide stabilized panels. High pressure steam treatment during pressing of wood composites has been studied and the process has been found effective and promising.The authors wish to thank Mr. Dwight A. Eusebio for his help in the preparation of this paperThis paper was presented at the IUFRO All Division 5 conference in Nancy, France, on August 15, 1992     

Preparation of composite board using foil-laminated and plastic-laminated liquid packaging paperboard as raw materials

We investigated the properties of composite board formed using base sheets of aluminum foil-laminated and polyethylene (PE) plastic-laminated liquid packaging paperboard (LP) as an alternative to recycling these items in wastepaper stream. Boards of different specific gravities ranging from 0.55 to 0.75 were made by pressing shredded LP blended with urea resin having resin content of 6%–10% at 180°C. Subsequently, we also prepared mixed particleboard [wood (WD) particles and LP mixed], three-layered particleboard (LP as the middle layer, WD in the upper and lower layers), and wood particleboard all having resin content of 10% and various specific gravities. Static bending and internal bonding strengths and thickness swelling of the specimens were determined to examine their properties. At the same specific gravity, the properties of LP particleboards were affected by their resin content. The modulus of rupture (MOR), modulus of elasticity (MOE), and internal bond strength of the LP particleboards increased with increasing specific gravity of the boards at the same resin content, but thickness swelling of the LP particleboards showed the reverse trend. The average MOR of the LP particleboards approximated that of the mixed particleboards and was greater than those of the three-layered particleboards and wood particleboards. Internal bond strength and thickness swelling of the LP particleboards were smaller than those of the other particleboards. Based on the above observations, we deemed that LP can be made into composite boards with adequate properties either alone or mixed with wood particles.     

Chemical changes of kenaf core binderless boards during hot pressing (II): effects on the binderless board properties

To provide basic information on self-bonding in kenaf core binderless boards, a series of chemical analyses was conducted on binderless boards and their chemical changes during hot pressing were examined in our previous study. In this study, binderless boards were manufactured under conditions that may accelerate the supposed chemical changes to investigate their effect on the board properties. First, to investigate the influence of the chemical bonds formed by carbonyl compounds on self-bonding, the influence of acetic acid addition prior to board manufacturing was studied and the effect of methanol extractives (containing the carbonyl compounds) was also examined. Second, the influence of the condensation reaction in lignin was discussed from the viewpoint of board density. Last, to examine the influence of thermal softening of lignin, the influences of temperature condition and moisture content, as well as those of microwave pretreatment, were investigated. As a result, the estimated chemical changes were suggested to influence the binderless board properties.     

喷蒸热压法棉秆无胶碎料板的研制

以棉秆为原料,采用喷蒸热压法研制无胶碎料板,探讨板的密度、蒸汽压力及喷蒸时间对棉秆无胶碎料板的物理力学性能的影响.结果表明:在试验范围内,随着板密度增大,无胶碎料板的静曲强度、弹性模量与内结合强度明显提高;提高蒸汽压力及延长喷蒸时间,能明显降低无胶碎料板的吸水厚度膨胀率.     

Water resistance properties of kenaf core binderless boards

Abstract Binderless boards were prepared from kenaf core under various manufacturing conditions and their water resistance properties were evaluated. The board properties evaluated were retention ratios of modulus of rupture (MOR) and modulus of elasticity (MOE), internal bonding strength after water treatment (IB), thickness swelling (TS), water absorption (WA), and linear expansion (LE). These values were then compared with those of boards bonded with urea-formaldehyde (UF), urea melamine formaldehyde (UMF), and phenol-formaldehyde (PF) resins, and their water resistance properties were assessed. We found that pressing temperature was one of the most important conditions for the improvement of water resistance properties. The retention ratios of MOR, MOE, and IB of kenaf core chip binderless boards (pressing temperature 200°C, target density 0.8g/cm³, and the three-step pressing of 6MPa for 10min, then 4MPa for 3min, and 2MPa for 3min) were 37.1%, 49.9%, and 55.7%, respectively, compared with values for UMF-bonded boards of 22.5%, 27.1%, and 40.7%, and values for PF-bonded boards of 42.8%, 41.8%, and 54.1%, respectively. The results showed that the water resistance properties of binderless boards were higher than those of UMF-bonded boards and almost as high as those of PF-bonded boards. Part of this article was presented at the 53rd Annual Meeting of the Japan Wood Research Society, Fukuoka, March 2003     

The effects of chemical components and particle size on the mechanical properties of binderless boards made from oak (<Emphasis Type="Italic">Quercus</Emphasis> spp.) logs degraded by shiitake fungi <Emphasis Type="Italic">(Lentinula edodes</Emphasis>)

Binderless boards are composite boards that rely on self-bonding mechanisms for inter-fibre bonding. Quercus acutissima and Quercus serrata logs degraded by Lentinula edodes (shiitake fungi) were used in this study to investigate whether physical and chemical changes induced by shiitake fungi can enhance board mechanical properties. Binderless boards were manufactured with 0.8 g/cm³ target density, 220 °C pressing temperature, 5 MPa pressure, and pressing duration of 10 min. Boards made from logs degraded for ≥?26 months were stronger than control boards and met modulus of rupture (MOR) and internal bonding (IB) requirements for fibreboards. Chemical composition and particle size distribution of the wood powder used to make the boards were determined to elucidate the drivers of board mechanical properties. The proportion of small particles (<?150 µm) showed a strong positive correlation with MOR for both species and hot water extractives showed a strong positive correlation with IB for Q. acutissima boards. Introduction of shiitake fungi pre-treatment to the production process may enhance the mechanical strength of binderless boards.     

Manufacture and mechanical properties of binderless boards from kenaf core

Binderless boards were prepared from finely ground powders of kenaf (Hibiscus cannabinus L.) core under varying manufacturing conditions. This research was designed to investigate their mechanical properties and evaluate the various manufacturing conditions: pressing temperature and time, pressing pressure, board density, board thickness, grain size of raw materials, and addition of furfural. The mechanical properties (i.e., modulus of rupture and elasticity, internal bonding strength) of boards increased with increasing board density and met the requirement for 15 type medium-density fiberboard (MDF) by JIS A 5905-1994. Thickness swelling and water absorption of boards exceeded the maximum permitted levels for 15 type MDF and S20 grade hardboard by JIS A 5905-1994, which indicates the low water-resistant property of binderless boards. In contrast to that in usual wood-based materials, internal bonding strength showed significant correlations with other board properties: modulus of rupture and elasticity, thickness swelling, and water absorption. We confirmed experimentally that the best manufacturing conditions proved to be as follows: pressing temperature 180°C, time 10min; pressing pressure 5.3MPa; board thickness 5mm; board density 1.0g/cm³; average grain size 53µm; and powder with no furfural content.Part of this paper was presented at the 52nd Annual Meeting of the Japan Wood Research Society, Gifu, April 2002     

Bond durability of kenaf core binderless boards II: outdoor exposure test

An outdoor exposure test was conducted on kenaf core binderless boards (pressing temperatures 200°, 180°, and 160°C; pressing pressure 3.0 MPa, time 10 min, target board thickness 5 mm, target board density 0.8 g/cm³) to estimate their bond durability. Modulus of rupture (MOR), modulus of elasticity (MOE), internal bonding strength (IB), thickness change, weight loss, Fourier transform infrared (FTIR) spectra, and color difference (ΔE*) by the CIE L^*a^*b^* system were measured at various outdoor exposure periods up to 19 months. These values were then compared with those of a commercial medium-density fiberboard (MDF; melamine-urea-formaldehyde resin; thickness 9.0 mm, density 0.75 g/cm³). Generally, dimensional stability and the retention ratios of MOR, MOE, and IB after the outdoor exposure test increased with increased pressing temperature of binderless boards. The MOR retention ratio of the kenaf core binderless boards with a pressing temperature of 200°C was 59.5% after 12 months of outdoor exposure, which was slightly lower than that of the MDF (75.6% after 11 months of outdoor exposure). Despite this, the bond durability of the kenaf core binderless boards should be viewed as favorable, especially when considering the fact that the retention ratio of 59.5% was achieved without binder and without obvious element loss. Part of this report was presented at the International Symposium on Wood Science and Technology, IAWPS2005, November 27-30, 2005, Yokohama, Japan     

蔗髓含量对蔗渣碎料板性能的影响研究

研究了蔗髓含量（质量分数）分别在10%、20%、30%、40%4种不同情况下蔗渣碎料板的密度、静曲强度、弹性模量、内结合强度、吸水厚度膨胀率和板面握钉力等物理力学性能的变化规律.结果发现，随蔗髓含量的增加，板材的密度增加，弹性模量和板面握钉力下降；在蔗髓含量低于20%以下时，蔗髓的存在对板材的静曲强度无明显影响，而随蔗髓含量增加，吸水厚度膨胀率影响显著上升；在蔗髓含量高于20%以上时，蔗髓的含量增加使板材静曲强度明显下降，而对吸水厚度膨胀率无影响；蔗髓的含量对板材的内结合强度影响不明显.     

Durability characteristics of cement-bonded particleboards manufactured from maize stalk residue

Cement-bonded particleboards of 6 mm in thickness were manufactured using maize stalk (Zea mays) particles of uniform sizes at three levels of board density and additive concentrations respectively. The bending strength and dimensional properties were assessed. Increase in board density and additive concentration caused increase in Modulus of rupture (MOR), Modulus of elasticity (MOE), and decrease in Thickness swelling (TS) and Water absorption (WA). The MOR, MOE and TS of the boards were significantly affected by board density except for WA, but additive concentration affected all the boards’ properties examined at p ≥ 0.05. Strong and dimensional stable cement-bonded boards could be manufactured from maize stalk particles with Portland cement as the binder after hot water treatment. Although the dimensional stability and mechanical strength properties of the boards were affected by the board density and additive concentration, the study revealed that cement-bonded particleboards could be manufactured from maize stalk (Zea mays) particles. However, the increase in board density and additive concentration could cause the increase in MOR and MOE, and cause the decrease in TS and WA of boards.     

Manufacture and properties of low-density binderless particleboard from kenaf core

Low-density binderless particleboards from kenaf core were successfully developed using steam injection pressing. The target board density ranged from 0.10 to 0.30g/cm³, the steam pressure used was 1.0MPa, and the steam treatment times were 7 and 10min. The mechanical properties, dimensional stability, and thermal and sound insulation performances of the boards were investigated. The results showed that the low-density kenaf binderless particleboards had good mechanical properties and dimensional stability relative to their low board densities. The board of 0.20g/cm³ density with a 10-min treatment time produced the following values: modulus of rupture 1.1MPa, modulus of elasticity 0.3GPa, internal bond strength 0.10MPa, thickness swelling in 24h water immersion 6.6%, and water absorption 355%. The thermal conductivity of the low-density kenaf binderless particleboards showed values similar to those of insulation material (i.e., rock wool), and the sound absorption coefficient was high. In addition, the boards are free from formaldehyde emission. Kenaf core appears to be a potential raw material for low-density binderless panels suitable for sound absorption and thermally resistant interior products.Part of this report was presented at the 52th Annual Meeting of the Japan Wood Research Society, Gifu, Japan, April 2002     

Blowout conditions and properties of isocyanate resin bonded particleboard manufactured from high-moisture particles using an air-injection press

Blowouts of particleboards were artificially induced by increasing the vapor pressure inside the boards. Isocyanate resin bonded boards were manufactured from high-moisture particles, and the blowouts and board properties were analyzed. Boards with a high resin content of 5 % showed high bonding strength and did not blow out when pressed at 190 °C, but blew out at a raised temperature of 210 °C to increase vapor pressure inside the boards, thereby showing that blowout occurred when vapor pressure inside the boards exceeded the bonding strength of isocyanate resin. Boards with a low resin content of 2.5 % had low bonding strength and blew out when manufactured without air injection, but were successfully manufactured with air injection that prevents blowouts. However, the injection of high-pressure air reduced the strength properties of the board and increased the coefficient of variation, likely due to the discharge of isocyanate resin from the boards. Therefore, very small local blowouts occurred inside the boards, which lowered the strength properties of some specimens and led to a large coefficient of variation. When the pressure of injected air was lowered, the strength properties increased and the coefficient of variation decreased. This was possibly because the low-pressure air allowed isocyanate resin to remain in the boards, resulting in virtually no parts showing very low-strength properties.     

一年生植物作为石膏刨花板原料的适应性

本文叙述了使用德国及中国建筑石膏和甘蔗渣、竹材、棉秆、麦秸、稻草等一年生植物生产石膏刨花板的适应性,分析了石膏的成分和性能,测定了缓凝剂和植物原料对石膏水化的影响。制板时采用不同的配方和板的密度,以评价一年生植物的使用价值。在所使用的原料中,甘蔗渣是良好的石膏刨花板原料。     

Properties of kenaf core binderless particleboard reinforced with kenaf bast fiber-woven sheets

Kenaf composite panels were developed using kenaf bast fiber-woven sheets as top and bottom surfaces, and kenaf core particles as core material. During board manufacture, no binder was added to the core particles, while methylene diphenyldiisocyanate resin was sprayed to the kenaf bast fiber-woven sheet at 50 g/m² on a solids basis. The kenaf composite panels were made using a one-step steam-injection pressing method and a two-step pressing method (the particleboard is steam pressed first, followed by overlaying). Apart from the slightly higher thickness swelling (TS) values for the two-step panels when compared with the one-step panels, there was little difference in board properties between the two composite panel types. However, the two-step pressing operation is recommended when making high-density composite panels (>0.45 g/cm³) to avoid delamination. Compared with single-layer binderless particleboard, the bending strengths in dry and wet conditions, and the dimensional stability in the plane direction of composite panels were improved, especially at low densities. The kenaf composite panel recorded an internal bond strength (IB) value that was slightly low because of the decrease of core region density. The kenaf composite panel with a density of 0.45 g/cm³ (one-step) gave the mechanical properties of: dry modulus of rupture (MOR) 14.5 MPa, dry modulus of elasticity (MOE) 2.1 GPa, wet MOR 2.8 MPa, IB 0.27 MPa, TS 13.9%, and linear expansion 0.23%.     

Effect of particle shape on linear expansion of particleboard

Hinoki (Japanese cypress) strand with 0.6mm thickness was hammer-milled to prepare three types of particles that had the same thickness but different lengths and widths. Screen analysis and image analysis were conducted to evaluate the shape and distribution of the particle dimensions. Laboratory-scale particleboards were fabricated at three density levels using these particles. To determine the true effect of particle shape on the linear expansion (LE) of the board, these boards exhibited almost the same temperature behavior during pressing, the same density profile, and the same bending properties at each board density level. LE at 40°C and 90% relative humidity of the board was found to be affected by the particle shape. The board composed of small particles showed a larger LE at the same density level. It was considered that the out-of-plane orientation angle of the particles affected the LE of the boards. Thickness swelling and internal bond strength were also affected by the particle shape.Part of this report was presented at the 50th annual meeting of the Japan Wood Research Society, Kyoto, April 2000     

Development of an air-injection press for preventing blowout of particleboard I: effects of an air-injection press on board properties

An air-injection press was developed to prevent particleboard from blowing out during the manufacturing process. The air-injection press, which has holes punched in the heating plates, injects high-pressure air into the board through the holes of one plate and releases the air through the holes of the other plate. The high-pressure air forces out vapor trapped within the board, thus preventing blowout. The newly developed press reduced the pressing time required for manufacturing board from high-moisture-content particles. However, the manufactured boards exhibited mechanical properties and dimensional stability inferior to conventionally manufactured boards.     

热压法制备速生杉木集成材工艺

采用脲醛树脂胶粘剂，运用热压胶合工艺，对速生杉木进行指接与侧拼胶合后制成集成材，并进行横向静曲强度和弹性模量测试：分析热压法制备速生杉木集成材的工艺可行性，讨论侧拼压力、胶合时间与热压温度对速生杉木集成材横向静曲强度与弹性模量的影响，为速生杉木集成材的热压法生产提供理论依据。试验结果表明，在本研究试验条件内，采用脲醛树脂作为胶粘剂，运用热压法制备速生杉木集成材是可行的。     

Effect of furnish type and high-density raw material from mill residues on properties of particleboard panels

The purposes of this study were to examine the use of furniture mill residues containing high-density raw materials in particleboard production and to evaluate the effect of mixing several types of furnish on board performance. Wood wastes collected from the furniture industry in Japan containing matoa (Pometia pinnata), Douglas-fir (Pseudotsuga menziesii), and sugi (Cryptomeria japonica) with different particle shapes were prepared as raw materials for use in the manufacture of experimental particleboards. Seven board types and three mixed boards were manufactured with three replications. Methylene diphenyl diisocyanate (MDI) resin was applied at 6 % content in mat preparation. The pressing conditions were temperature of 180 °C, initial pressure of 3 MPa, and pressing time of 5 min. The target density was 0.72 g/cm³. This study showed that matoa particleboard had properties suitable for use in interior applications, although its properties were considered inferior compared with other particleboards. Improvement of matoa particleboard could be achieved by mixing with higher quality wood particles such as those from sugi or Douglas-fir. The furnish type used in this study affected board performance. All residues from furniture mills have the potential to be used for particleboard production, even when they contain different furnish types and wood species.