Sandwich panel of veneer-overlaid low-density fiberboard

Low-density sandwich panels of veneer-overlaid fiberboards of 12 mm thickness for structural use were manufactured at densities of 0.3–0.5g/cm³ using an isocyanate compound resin adhesive and steam injection pressing method. The effects of board density, veneer thickness, and resin content on the fundamental properties of sandwich panels were examined, with the following results: (1) The dry moduli of rupture and elasticity in the parallel direction of sandwich panels with thicker veneers were superior. The dry moduli of rupture and elasticity in the parallel direction of sandwich panels with 2.0 mm thick veneer at densities of 0.4–0.5 g/cm³ were 40–60 MPa, and 5–8 GPa, which were two and four times as much as those of homogeneous fiberboards, respectively. (2) The higher-density panels exhibited tensile failure at the bottom veneer surface during static dry bending in a parallel direction, whereas lower-density panels experienced horizontal shear failure in the core. (3) The dimensional stability of sandwich panels had good dimensional stability, with negligible springback after accelerated weathering conditions. (4) The thermal insulation properties of sandwich panels were found to be much superior to other commercial structural wood composite panels.Part of this report was presented at the 47th annual meeting of the Japan Wood Research Society, Kouchi, April 1997     

Development of binderless fiberboard from kenaf core

Binderless fiberboards with densities of 0.3 and 0.5 g/cm³ were developed from kenaf core material using the conventional dry-manufacturing process. The effects of steam pressure (0.4–0.8 MPa) and cooking time (10–30 min) in the refining process, fiber moisture content (MC) (10%, 30%), and hot-pressing time (3–10 min) on the board properties were investigated. The results showed that kenaf core binderless fiberboards manufactured with high steam pressure and long cooking time during the refining process had high internal bond (IB) strength, low thickness swelling (TS), but low bending strength values. The binderless fiberboards made from 30% MC fibers showed better mechanical and dimensional properties than those from air-dried fibers. Hot-pressing time was found to have little effect on the IB value of the binderless board at the refining conditions of 0.8 MPa/20 min, but longer pressing time resulted in lower TS. At a density of 0.5 g/cm³, binderless fiberboard with the refining conditions of 0.8 MPa/20 min recorded a modulus of rupture (MOR) of 12 MPa, modulus of elasticity (MOE) of 1.7 GPa, IB of 0.43 MPa, and 12% TS under the optimum board manufacturing conditions. Part of this article was presented at the 54th Annual Meeting of the Japan Wood Research Society, Hokkaido, August 3–5, 2004     

Reinforcement of fiberboard containing lingo-cellulose nanofiber made from wood fibers

Wood-based materials are fabricated with adhesives composed of various materials derived from fossil fuels. It is difficult to identify replacements for these chemical adhesives. This study explored nanofiber technologies as an alternative to these adhesives. In this study, we focused on reinforcement effects of lingo-cellulose nanofiber (LCNF) on fiberboards made from softwood and hardwood fiber. We discuss the density effects of reinforcement with LCNF because the density of medium-density fiberboard (MDF), which is widely used for construction, is standardized at about 0.60–0.80 g/cm³. Fiberboards were manufactured with three densities (0.60, 0.75, and 1.00 g/cm³). For softwood fiberboards, the bending properties for LCNF-mixed boards were higher than those for the control fiberboards at all densities. In this paper, control fiberboard means fiberboard with fiber only. For hardwood fiberboards, the bending properties for LCNF-mixed fiberboard for 1.00 g/cm³-density board were higher than those for the control fiberboard. For internal bond strength (IB), the IB for LCNF-mixed fiberboard was higher than that for the control fiberboard. The thickness swelling (TS) and weight change (WC) with water absorption for fiberboards containing LCNF were lower than those for control fiberboards. As a conclusion, physical and mechanical properties of the resulting fiberboards were significantly improved with the addition of LCNF, especially for softwood fiberboards, due to close binding between LCNF and wood fibers.     

Formation of the density profile and its effects on the properties of fiberboard

Two main types of fiberboards were produced using lauan (Shorea spp.) fibers with an isocyanate resin as the binder; fiberboard with a flat, homogeneous (homoprofile), and typical U-shaped (conventional) density profile along the board thickness. The processing parameters included manipulation of mat moisture content distribution, press closing speed, and hot pressing method. The results are summarized as follows: (1) A larger variation was observed in the peak density (PD) and core density (CD) of fiberboards at 0.5g/cm³ mean density (MD) level than in those at 0.7 g/cm³. Generally, PD showed a greater variation than CD, irrespective of MD level. (2) Boards produced using two-step hot pressing recorded substantially higher PD with reduced CD. (3) Multiple regression analysis showed that CD and PD could be calculated based on the other profile defining factors, and a rough estimation for peak distance and gradient factor was possible. (4) Based on static bending, conventional fiberboard had a higher modulus of rupture (MOR) than the homo-profile board but a similar modulus of elasticity (MOE). (5) At 0.5 g/cm³ the MOR and dynamic MOE of fiberboard increased by up to 67% and 62%, respectively, when the PD increased from 0.5 to 1.07 g/cm³. Similarly, an increase of PD from 0.7 to 1.1 g/cm³ resulted in corresponding increases of 55% and 34% in the MOR and dynamic MOE of 0.7 g/cm³ boards. (6) The internal bond strength and screw withdrawal resistance were almost entirely dependent on the CD and MD, respectively. (7) Homo-profile fiberboards registered higher thickness swelling and water absorption than conventional fiberboards throughout the dry/wet conditioning cycle.     

Strength,decay and termite resistance of oriented kenaf fiberboards

The development of oriented fiberboards made from kenaf (Hibiscus cannabinus L.) and their suitability as a construction material has been investigated. Three different types of boards consisting of five layers with individual orientations were prepared using a combination of low molecular weight and high molecular weight phenol-formaldehyde (PF) resin for impregnation and adhesion purposes. Additional boards with the same structure were prepared using high molecular weight PF resin only. The mechanical properties of the boards have been examined as well as their resistance against fungal decay and termite attack. All kenaf fiberboards showed elevated mechanical properties compared with medium-density fiberboard made from wood fibers, and showed increased decay and termite resistance. Differences in the decay and termite resistance between the board types were caused by the presence of the low molecular weight PF resin for the impregnation of the fibers. No significant difference was found for the mechanical properties. The effect of the PF resin for impregnation was much clearer in fungal decay resistance than for termite resistance; however, fiber orientation had no effect on both decay and termite resistance of the specimens.     

Manufacture and properties of low-density binderless particleboard from kenaf core

Low-density binderless particleboards from kenaf core were successfully developed using steam injection pressing. The target board density ranged from 0.10 to 0.30g/cm³, the steam pressure used was 1.0MPa, and the steam treatment times were 7 and 10min. The mechanical properties, dimensional stability, and thermal and sound insulation performances of the boards were investigated. The results showed that the low-density kenaf binderless particleboards had good mechanical properties and dimensional stability relative to their low board densities. The board of 0.20g/cm³ density with a 10-min treatment time produced the following values: modulus of rupture 1.1MPa, modulus of elasticity 0.3GPa, internal bond strength 0.10MPa, thickness swelling in 24h water immersion 6.6%, and water absorption 355%. The thermal conductivity of the low-density kenaf binderless particleboards showed values similar to those of insulation material (i.e., rock wool), and the sound absorption coefficient was high. In addition, the boards are free from formaldehyde emission. Kenaf core appears to be a potential raw material for low-density binderless panels suitable for sound absorption and thermally resistant interior products.Part of this report was presented at the 52th Annual Meeting of the Japan Wood Research Society, Gifu, Japan, April 2002     

Manufacture of oriented board using mild steam treatment of plant fiber bundles

This study investigated the effects of mild steam treatment (0.1 MPa for 2 h) of natural bio-based fibers and orientation (0° and 90°) of those fibers in various fiberboards. Ramie bast, pineapple leaf, and sansevieria fiber bundles were used as materials. The composite fiberboards were prepared using phenol-formaldehyde (PF) resin. To investigate the effect of mild steam treatment on wettability, contact angles of PF resin to the fiber were measured. The mechanical properties of the boards were examined as well as their dimensional stability. The contact angle data showed that mild steam treatment was effective in improving the wettability of fibers. Unioriented steam-treated boards showed better performance of internal bond (IB), moduli of rupture (MOR) and elasticity (MOE), thickness swelling (TS), and water absorption (WA) than other boards. Unioriented steam-treated sansevieria board with longitudinal fiber direction showed higher average values of MOR (403 MPa), MOE (39.2 GPa), and IB (1.33 MPa) and lower values of TS (5.15%) and WA (8.68%) than other boards. The differences in the mechanical properties and dimensional stability of boards were found mainly due to the differences in the ratios of fiber fraction of the boards to the density of the fiber bundles.     

苎麻增强木材纤维压制纤维板初探

以苎麻纤维作为植物增强材料添加到木纤维表面并压制成低密度纤维板,通过对改性低密度纤维板的物理力学性能进行分析,认为苎麻作为木材纤维增强材料完全可行.     

Formation of the density profile and its effects on the properties of particleboard

Summary Two types of particleboards bonded with an isocyanate resin, one with uniform vertical density profile (homo-profile), and the other with conventional U-shaped profile, were fabricated to various density levels using lauan (Shorea spp.) particles. The fundamental relationships between the density profile and the board properties were determined, and the results are summarized as follows: 1. In homo-profile boards, the moduli of rupture (MOR) and elasticity (MOE), internal bond (IB) strength, and screw withdrawal resistance (SWR), are highly correlated to the board mean density. 2. The bottom limit of the board density is estimated to be ca. 0.25 g/cm³, based on the correlation regressions between mechanical properties and mean density. 3. At equal mean density level, the MOR and MOE of the conventional particleboards are higher than the homo-profile boards, due to the higher density near the faces. However, the reverse is true for IB, owing to the presence of the low density core in the former. 4. The net impact of peak density on MOR and MOE is greater at higher mean density level while raising the core density results in more pronounced improvement in IB at lower density. 5. In addition to the compaction ratio, the dimensional stability of the board is also affected by the peak area and mat moisture content. Received 9 January 1997     

Thermal insulation properties of wood-based sandwich panel for use as structural insulated walls and floors

Thermal insulation and warmth-keeping properties of thick plywood-faced sandwich panels with low-density fiberboard (plywood-faced sandwich, PSW), which were developed as wood-based structural insulation materials for walls and floors, are comprehensively clarified. The properties focused on were thermal conductivity (λ), thermal resistance (R), and thermal diffusivity (D). The results for PSW panels were compared with those for commercial wood-based boards, solid wood, and commercial insulators. The λ values were measured for PSW panels and their core and face elements. As a result, the composite theory of λ was found to be appropriate for PSW composites, because the calculated/experimental λ ratios were approximately 90%. The λ values for PSW panels with densities of 340 kg/m³ (PSW350) and 410kg/m³ (PSW400) were 0.070 and 0.077W/mK, respectively. The R values for PSW350 and PSW400 were 1.4 and 1.2m²K/W, and the D values were 0.00050 and 0.00046m²/h, respectively. Consequently, the PSW provided thermal insulation properties superior to those of the boards and in terms of warmth-keeping properties were greatly advantageous over the insulators. These advantages were due to the moderate densities of PSW panels. The PSW panel with sufficient thickness showed remarkably improved thermal resistance compared with those of the boards.     

改性脲醛树脂胶低密度稻壳-木材复合材料制造工艺的研究

采用异氰酸酯(ISO)改性的脲醛树脂胶制造低密度稻壳-木材复合材料。稻壳与木质刨花的混合比例为1:1,施胶量为7%,试验结果表明,异氰酸酯改性的脲醛树脂胶黏剂适用于低密度稻壳-木材复合材料,其物理力学性能明显优于使用传统的脲醛树脂胶黏剂。低密度稻壳-木材复合材料的物理力学性能随着改性剂异氰酸酯用量的增加而提高。密度是稻壳-木材复合材料物理力学性能的重要影响因素,低密度稻壳-木材复合材料的物理力学性能随着密度的增加而提高。在设定密度为0.45g/m~3和0.5g/cm~3的条件下,3:4的ISO/UF的稻壳-木材复合材料的物理力学性能均达到日本刨花板工业标准(JIS A5908)的要求。     

Effects of low bondability of acetylated fibers on mechanical properties and dimensional stability of fiberboard

Fiberboards were prepared from acetylated fibers with various weight gains: 0, 4.7, 9.4, 18.5, and 24.8 weight percent gain (WPG). The effects of low bondability of acetylated fibers on mechanical properties and dimensional changes were determined. The decreased mechanical properties of acetylated fiberboard are mainly due to low bondability. To improve bending strength, high face density is also needed. The thickness swelling according to JIS and the linear expansion under relative humidity changes decreased with increasing WPG. As for accelerated weathering and the outdoor exposure test, the thickness changes in 4.7–18.5 WPG boards were much higher than those in OWPG board and 24.8 WPG board. The high thickness change in 4.7–18.5 WPG boards is due to low bondability. Although 24.8 WPG board also has low bondability, the thickness change of 24.8 WPG board decreased. The high dimensional stability of acetylated fibers, caused by high WPG, probably outweighs the dimensional change caused by low bondability. On the other hand, during the boiling test the thickness changes in 24.8 WPG board and the 4.7–18.5 WPG boards were higher than those in 0 WPG board. The effect of the boiling test on the boards is more severe than that seen with the accelerated weathering and outdoor exposure test; therefore, the effects of the low bondability probably cancel the effects of the high WPG. It is necessary to increase the bondability of acetylated fibers to improve the dimensional stability and the mechanical properties.     

预制竹木组合墙体的保温与隔声性能

根据预制建筑构件的特点,制备了总厚度为50mm、三种不同结构的竹木组合预制墙体构件,对其保温、空气隔声性能进行了测评。结果表明:竹木空心墙体的保温和隔声性能最差,但在墙体内部添加岩棉,墙体的性能得到显著改善;将内墙板由竹胶合板换成石膏板后,墙体的保温、隔声性能无明显变化。     

Veneer strand flanged I-beam with MDF or particleboard as web material IV: Effect of web material types and flange density on the basic properties

The balance of strength between the flange and web parts of veneer strand flanged I-beam was investigated by the following methods: (1) use of different web material types, such as plywood, oriented strand board (OSB), particleboard (PB), and medium density fiberboard (MDF), that have different strength properties; and (2) fabrication of I-beams with low-density flanges using low-density strands with PB web material. Replacing PB or MDF with plywood showed slight significant improvement in the modulus of rupture but not in the modulus of elasticity of the entire I-beam. However, PB and MDF showed competent performance in comparison with OSB, thus strengthening the promising future of the use of PB or MDF as web material to fabricate I-beams. Hot-pressing conditions used for I-beam production exerted slightly adverse effects on the bending properties of PB, but not on MDF, OSB, and plywood web materials. The flange density of 0.60 g/cm³ was considered to be the lower limit that provides I-beams with balanced mechanical properties and dimensional stability.     

氢化萜烯马来酸酐与环氧树脂固化物的性能研究

研究了氢化萜烯马来酸酐(HTMA)与环氧树脂固化物的机械强度、热稳定性及电气绝缘等性能及其主要影响因素.实验结果表明,采用氢化萜烯马来酸酐固化后的环氧树脂具有较好的机械强度、热稳定性及电气绝缘性能.氢化萜烯马来酸酐的化学结构与固化物的机械强度及热稳定性密切相关.不同化学结构脂环酸酐固化后的环氧树脂电气绝缘性能相近.     

汽爆压力对无胶棉秆纤维板性能的影响

不添加任何化学助剂,在不同汽爆压力下进行棉秆解纤,将解纤后的纤维热压制成无胶纤维板.分析了汽爆压力对棉秆纤维形态、化学成分以及无胶纤维板产品性能的影响.结果表明,随着汽爆压力的增大,纤维分离程度提高,纤维中游离酸、游离糖及游离醇的质量分数含量增加,试板的内结合强度增大,但静曲强度和弹性模量则减小.     

吸声保温玉米秸秆穰板制备及性能研究

以疏解后的玉米秸秆穰丝为基材,异氰酸酯为胶黏剂,均匀组坯后经热压制备成吸声保温玉米秸秆穰板。通过单因素试验分别探究了施胶量、热压温度板材密度、厚度对玉米秸秆穰板吸声、导热和压缩性能的影响。结果表明:综合板材的性能和生产成本,优化工艺为施胶量2%、热压温度140℃、密度0.10 g/cm3,所得板材吸声性能达到GB/T 16731—1997的Ⅲ级标准,压缩强度满足GB/T 25975—2010中的要求,属高效保温材料。     

轻质豆秸刨花板工艺的研究

从UF胶制造轻质豆秸刨花板的初步研究,分析了板的密度、施胶量、热压时间等工艺因子对板性能的影响。试验结果表明,利用豆秸制造轻质刨花板是完全可行的,其产品主要物理力学性能为:密度0.483 g/cm 3、吸水厚度膨胀率11.2 % 、内结合强度0.303 MPa、静曲强度8.98 MPa,均达到日本JISA 5908 的技术指标。     

稻壳形态对稻壳--木材复合材料性能的影响

测试了稻壳形态对稻壳-木材复合材料物理力学性能的影响。试验结果表明，以20网日、30网日和40网目的稻壳为补充材料制备的密度为0．80g／cm^3的板的物理力学性能均达到国标二级品的要求。确立20网目的稻壳适宜于稻壳-木材复合材料。     

汽车车厢底板用竹木复合板的研制

采用马尾松作芯板、竹片作表板、酚醛树脂作胶粘剂，制造汽车车厢底板用竹木复合板。在确定的涂胶量、热压温度、热压时间条件下，研究了不同的热压压力与竹木复合板性能的关系，得出了适宜的热压工艺条件。研究结果表明，竹木复合板的物理力学性能达到林业行业标准ＬＹ１０５５—９１规定的指标值，为充分、合理、经济、有效地利用竹木资源提供了依据