Effects of water soaking and outdoor exposure on modulus of rupture and internal bond strength of particleboard

Phenol–formaldehyde resin-bonded particleboard (PF board) and isocyanate resin-bonded particleboard (MDI board) were soaked in water at 40, 70 and 100 °C, and the relationships between soaking conditions and board properties were analyzed. The relationships between the deterioration of board properties resulting from water soaking and those arising from outdoor exposure were also analyzed. At 100 °C, the modulus of rupture (MOR) and internal bond strength (IB) of the PF board decreased significantly within the first hour, and subsequently constant values were shown with increasing soaking time. This low constant value was defined as the lower limit. At 70 °C, both the MOR and IB decreased with increasing soaking time, and reached the lower limit. At 40 °C, however, neither decreased significantly with increasing soaking time and neither reached the lower limit. The MOR of the MDI board showed the same trend as the PF board. However, the IB of the MDI board showed a different trend to the PF board, that is, the lower limit of IB required extensive soaking, even at 100 °C. The MOR and IB of both the PF and MDI boards reached the lower limit when thickness change peaked. On the other hand, the MOR and IB for outdoor exposure were lower than those for water soaking, even at the same thickness change. The MOR and IB of water soaking decreased owing to the collapse of the bonding points caused by board swelling. On the other hand, the board properties of outdoor exposure decreased owing to the collapse of the bonding points, and biodegradation also added to the decrease.     

Evaluation of particleboard deterioration under outdoor exposure using several different types of weathering intensity

The deterioration of particleboards for construction use was investigated by outdoor exposure tests at eight sites in Japan over 7 years. Two types of particleboard with different water resistances were tested and the deterioration of mechanical properties such as modulus of rupture, internal bond strength and lateral nail resistance was investigated. In order to eliminate regional differences in the board deterioration and also to standardize a deterioration factor for the board exposed to varying climate conditions, we introduced the weathering intensity (WI) defined by monthly precipitation multiplied by monthly average temperature. The significance of this factor was investigated by correlation analysis. Three conventional climate indexes relevant to the durability of wood were also investigated to analyze their significance to WI for particleboard deterioration. It was found that our definition of weathering intensity was the most accurate and the exposure period that reduces initial bending strength by half was calculated by the use of regression analysis for several different sites worldwide.     

Effects of sealed press on improving the properties of particleboard

To improve the properties of particleboard, boards were produced using a sealed press. With the sealed press, boards were processed under high-temperature and high-pressure steam. This increased the saturation temperature, causing a dramatic rise in temperature inside the board, faster curing of the binder, and a shorter pressing time. The boards were bonded with urea formaldehyde resin, melamine urea formaldehyde resin, or poly(methylene diphenyl diisocyanate) (PMDI). The sealed press improved the internal bond strength and thickness swelling of boards regardless of the binder used during the reduced pressing time. The increased bonding strength improved the board properties, allowing PMDI with a lower resin content to be used for bonding the boards.     

Effect of buffers on gypsum particleboard properties

The paper recounts how buffers affect the physical and mechanical properties of gypsum particleboard (GPB) and the initial curing time (IC) of gypsum. The acidic buffers were better than alkaline buffers for prolonging the IC of gypsum and affecting the properties of GPB. Weak acids were advantageous for curing gypsum. When suitable amounts of citric acid and trisodium citrate were added, high performances could be achieved and the IC of gypsum could be prolonged to about 2h. When alkaline buffers such as sodium carbonate were added, the 1C of gypsum was still short but the internal bond strength (IB), modulus of elasticity (MOE), and modulus of rupture (MOR) of GPB were obviously decreased. Citric acid was the best among the four buffers used; and the GPB had a good IB, MOE, MOR, and adequate IC when citric acid of 0.1% was added. Sodium carbonate was not suitable owing to low performance and short IC. Gypsum curing is an endothermic reaction.Part of this paper was presented at the 11th Annual Meeting of the Chugoko Skikoku Branch of the Japan Wood Research Society, Matsue, September 1999     

刨花板抗静电性能的研究

通过全电流充放电法，测得在刨花施胶过程中施加不同种类和数量的抗静电添加剂时，刨花板体积电阻率呈下降趋势，并借此讨论了刨花板的抗静电机理，分析了抗静电性能。研究结果表明：抗静电剂ＳＮ与石墨或甘油共同作为抗静电添加剂时，刨花板体积电阻率下降明显。与普通刨花板相比，电阻率下降了二个数量级。此外，刨花板的含水率和密度，对其抗静电性能也有较大影响。     

The lamination influence on properties of agro-based particleboard

Abstract

Response surface methodology (RSM) based on a three-level, three-variable central composite rotatable design was applied to evaluate the effects of the parameters such as ratio of rice straw (Oryza sativa)/poplar (Populus deltoids) wood particle bonded with urea-formaldehyde resin in panels, species of wood veneer coating these panels and amount of adhesive in glue line on the modulus of rupture (MOR), internal bonding (IB), and thickness swelling (TS) of panels. Mathematical model equations were derived by computer simulation programming to optimize the properties of the particleboard. These equations that are second-order response functions representing MOR, IB, and TS were expressed as functions of three operating parameters of panel properties. Predicted values were found to be in a good agreement with experimental values (R ² values of 0.96, 0.98 and 0.98 for MOR, IB, and TS, respectively). This study has shown that the RSM could efficiently be applied for modeling panel properties. It was found that the variables affected the properties of panels. Straw usage up to 30% in the mixture did not cause a significant decrease in MOR, IB, and TS. Using beech veneer and 190 g/m² glue line had the highest MOR and lowest TS.     

无机复合型阻燃剂对稻草刨花板阻燃性能的影响

选用氢氧化铝(ATH)与硼酸锌(ZB)组成的无机复合型阻燃剂压制阻燃稻草刨花板,采用锥形量热仪法研究不同配比的ATH和ZB对稻草刨花板阻燃性能的影响。结果表明:无机复合型阻燃剂能有效减少稻草刨花板的热释放和烟释放,减少烟气中CO和CO2的释放浓度,降低燃烧过程中的质量损失速率,表现出良好的阻燃抑烟效果;ATH与ZB具有协同阻燃作用,ZB的加入能有效提高复合阻燃剂的阻燃效果,减少ATH的用量,10%的ATH用量可达到比较好的阻燃效果。     

Effects of air injection on properties of particleboard manufactured using a radio-frequency hot press

The effectiveness of air injection for preventing the blowout of particleboards manufactured using a radio-frequency hot press was investigated by evaluating the board properties under artificially created conditions that were conducive to blowout. For evaluation, 10-mm-thick boards with densities of 0.7 and 0.8 g/cm³ and 20-mm-thick boards with a density of 0.7 g/cm³ were manufactured. Pressing times for the 10-mm-thick boards were 2, 4, 6, and 8 min, and those for the 20-mm-thick boards were 4, 6, 8, and 10 min. Without air injection, blowout occurred in all manufactured boards. With air injection, however, blowout did not occur in the 10-mm-thick boards with a density of 0.7 g/cm³. Moreover, air injection prevented blowout even when the board density and board thickness were increased to 0.8 g/cm³ (for 10-mm-thick boards) and 20 mm (the density was kept at 0.7 g/cm³), respectively. Air-injection radio-frequency pressing reduced the pressing time from 4 to 2 min for 10-mm-thick boards, and from 6 to 4 min for 20-mm-thick boards. Moreover, this reduction in the pressing time was achieved without a large reduction in the internal bond strength of the boards.     

Preparation and properties of waste tea leaves particleboard

Urea-formaldehyde (UF) adhesive is the main source of formaldehyde emission from UF-bonded boards. The components in waste tea leaves can react with formaldehyde to serve as a raw material in the production of low formaldehyde emission boards. In our study, waste tea leaves and UF adhesive were employed in the preparation of waste tea leaves particleboard (WTLB). An orthogonal experimental method was applied to investigate the effects of process parameters on formaldehyde emission and mechanical properties of WTLB. The results indicated that: 1) waste tea leaves had the ability to abate formaldehyde emission from boards; and 2) density of the WTLB was a significant factor affecting its modulus of rupture (MOR), modulus of elasticity (MOE) and internal bonding (IB).     

Elastic properties of the extruded tubular particleboard

Abstract

Particleboard can be commonly produced by flat-pressing and extrusion methods. The elastic properties of the flat-pressed particleboard have been studied a lot, but the extruded particleboard has not had much attention. Six elastic properties of two commercial extruded tubular particleboards with different solid density were measured by a three-point bending test and electric resistance gages method. The elastic modulus in the extruded direction of the tubular particleboard is only one-tenth of the other two directions. The extruded tubular particleboard can not only be regarded as an orthotropic material but also a transverse surface isotropic material. The isotropic plane is the transverse section of the extruded particleboard which is different from the flat-pressed particle with the length–width plane as the isotropic plane. The checking of the data we measured demonstrated suitability and rationality.     

Effects of mat moisture content and press closing speed on the formation of density profile and properties of particleboard

Isocyanate resin-bonded 0.5 and 0.7 g/cm³ lauan (Shorea sp.) particleboards were produced from mats with uniform and distributed moisture content (MC) distributions, using three hot press closing speeds. The effects of these processing variables on the formation of density profile in particleboard and board properties were analyzed statistically. A definition of the density profile was introduced, and the correlations among the various defining factors were established. The results are summarized as follows. (1) The peak density (PD) of particleboard could be increased, with a slight reduction in the core density (CD), using mats with different MC distributions. (2) In a conventional density profile, CD and PD are highly dependent on the board mean density (MD); and the gradient factor (GF), peak distance from the faces (Pdi), and peak base (Pb) are significantly correlated to each other, at the 99% significance level. (3) Greater press closing speed reduces Pdi and Pb, with an increase in GF. (4) Greater press closing speed could increase the PD in board of low MD, with minimal effect on CD. (5) The modulus of elasticity (MOE) of particleboards from mats with high MC near the faces were consistently higher than those from mats with uniform MC, irrespective of the press closing speed, whereas their modulus of rupture (MOR) became indifferent at higher MD under slow and fast closing speeds. (6) Sanding does not improve the MOR and MOE of particleboard significantly.     

Improvement on the properties of gypsum particleboard by adding cement

Gypsum particleboard (GPB) has high thickness swelling (TS), high water absorption (WA), and low mechanical properties compared with cement-bonded particleboard. The properties of GPB were improved by adding cement. The experimental results showed that GPB with the added cement had good physical and mechanical properties compared with those of gypsum particleboard with no added cement. The TS and WA of gypsum particleboard with added cement were reduced by 10%. The mechanical properties of GPB, such as internal bond strength (IB), modulus of rupture (MOR), and modulus of elasticity (MOE), increased when the GPB was made with added cement. The properties of GPB improved relative to the quantity of cement added. With an increase of cement content from 5% to 10%, the TS and WA were reduced, and the IB, MOR, and MOE were increased. In contrast, the TS and WA increased and the IB, MOE, and MOR decreased when the cement content was increased from 15% to 30%. Thus the physical and mechanical properties of GPB were successfully improved when the added cement content was 10%.An outline of this paper was presented at the 47th Annual Meeting of the Japan Wood Research Society in Kochi, April 1997     

THE EFFECTS OF WETTING AND REDRYING CYCLE ON PHYSICAL PROPERTIES OF PARTICLEBOARD

INTR0DUCTI0NOvertheyearsmmpresearchershavefoundUFandPFparticleboardstoedsbitsimilarshorttermphysicalpropeniesatlowhumidityandtemperatUre(DeainandOstInan,l983).DifferentbehaviorpatternsbetWeentl1eresinsemefgeasrelativehumidityandtem-peratUrerise,finallycouldresultinthefailureofboards(R0dwell,l99l).AnumberofworkshavequestionedWhetherhydrolysisistheonlyfactorinvolvedinb0ndfailure.Irlereported(l986)thedifferenteffectsofwettingandredryingonthepropertiesofpureUFandPFresinfilms.Soitmaybeim…     

Manufacture and properties of low-density binderless particleboard from kenaf core

Low-density binderless particleboards from kenaf core were successfully developed using steam injection pressing. The target board density ranged from 0.10 to 0.30g/cm³, the steam pressure used was 1.0MPa, and the steam treatment times were 7 and 10min. The mechanical properties, dimensional stability, and thermal and sound insulation performances of the boards were investigated. The results showed that the low-density kenaf binderless particleboards had good mechanical properties and dimensional stability relative to their low board densities. The board of 0.20g/cm³ density with a 10-min treatment time produced the following values: modulus of rupture 1.1MPa, modulus of elasticity 0.3GPa, internal bond strength 0.10MPa, thickness swelling in 24h water immersion 6.6%, and water absorption 355%. The thermal conductivity of the low-density kenaf binderless particleboards showed values similar to those of insulation material (i.e., rock wool), and the sound absorption coefficient was high. In addition, the boards are free from formaldehyde emission. Kenaf core appears to be a potential raw material for low-density binderless panels suitable for sound absorption and thermally resistant interior products.Part of this report was presented at the 52th Annual Meeting of the Japan Wood Research Society, Gifu, Japan, April 2002     

Utilization of sweet sorghum bagasse and citric acid for manufacturing of particleboard II: influences of pressing temperature and time on particleboard properties

Development of environmentally friendly particleboard made from sweet sorghum bagasse and citric acid has recently attracted attention. In this study, we investigated the effects of pressing temperature and time on physical properties, such as dry bending (DB), internal bond strength (IB), and thickness swelling (TS) of particleboard. Wet bending (WB), screw-holding power (SH), biological durability, and formaldehyde emission of particleboard manufactured under effective pressing temperature and time were also evaluated. Particleboards bonded with phenol formaldehyde (PF) resin and polymeric 4,4′-methylenediphenyl isocyanate (pMDI) were manufactured as references. Effective pressing temperature and time were 200?°C and 10 min, respectively. It was clarified that DB, IB, and TS satisfied the type 18 requirements of the JIS A 5908 (2003), and were comparable to those of particleboard bonded with PF and pMDI. The WB and SH of particleboard did not satisfy type 18 of JIS. Particleboard manufactured under effective pressing conditions had good biological durability and low formaldehyde emission. Based on the results of infrared spectra measurement, the degree of ester linkages increased with increased pressing temperature and time.     

Formation of the density profile and its effects on the properties of particleboard

Summary Two types of particleboards bonded with an isocyanate resin, one with uniform vertical density profile (homo-profile), and the other with conventional U-shaped profile, were fabricated to various density levels using lauan (Shorea spp.) particles. The fundamental relationships between the density profile and the board properties were determined, and the results are summarized as follows: 1. In homo-profile boards, the moduli of rupture (MOR) and elasticity (MOE), internal bond (IB) strength, and screw withdrawal resistance (SWR), are highly correlated to the board mean density. 2. The bottom limit of the board density is estimated to be ca. 0.25 g/cm³, based on the correlation regressions between mechanical properties and mean density. 3. At equal mean density level, the MOR and MOE of the conventional particleboards are higher than the homo-profile boards, due to the higher density near the faces. However, the reverse is true for IB, owing to the presence of the low density core in the former. 4. The net impact of peak density on MOR and MOE is greater at higher mean density level while raising the core density results in more pronounced improvement in IB at lower density. 5. In addition to the compaction ratio, the dimensional stability of the board is also affected by the peak area and mat moisture content. Received 9 January 1997     

Some of the properties of particleboard made from paulownia

The objective of this study was to determine some of the properties of experimental particleboard panels made from low-quality paulownia (Paulownia tomentosa). Chemical properties including holocellulose, cellulose, lignin contents, water solubility, and pH level of the wood were also analyzed. Three-layer experimental panels were manufactured with two density levels using urea–formaldehyde as a binder. Modulus of elasticity (MOE), modulus of rupture (MOR), internal bond strength (IB), screw-holding strength, thickness swelling, and surface roughness of the specimens were evaluated. Panels with densities of 0.65 g/cm³ and manufactured using a 7-min press time resulted in higher mechanical properties than those of made with densities of 0.55 g/cm³ and press times of 5 min. Based on the initial findings of this study, it appears that higher values of solubility and lignin content of the raw material contributed to better physical and mechanical properties of the experimental panels. All types of strength characteristics of the samples manufactured from underutilized low-quality paulownia wood met the minimum strength requirements of the European Standards for general uses.     

Interaction analysis between slenderness ratio and resin content on mechanical properties of particleboard

The interaction between particle size and resin content is one of the most important structural parameters that can influence the accuracy of predictions about wood-composite properties. We developed three kinds of equation (linear, quadratic, and exponential) for each mechanical property of particleboard based on slenderness ratio and resin content at a constant density (0.7g cm -3 ). Results from SHAZAM software (version 9) suggested that the quadratic function was not significant, but the linear and exponential functions were significant. The interaction between particle size and resin content was analyzed by Maple 9 software. The results indicated that an exponential function can better describe the simultaneous effect of slenderness and resin content than a linear equation. Under constant resin content, particles with higher slenderness ratios increased more in modulus of rupture (MOR) and modulus of elasticity (MOE) than did particles with lower slenderness ratios. Edge withdrawal resistance (SWRe) values did not increase with increasing slenderness ratio.