Manufacture and mechanical properties of binderless boards from kenaf core

Binderless boards were prepared from finely ground powders of kenaf (Hibiscus cannabinus L.) core under varying manufacturing conditions. This research was designed to investigate their mechanical properties and evaluate the various manufacturing conditions: pressing temperature and time, pressing pressure, board density, board thickness, grain size of raw materials, and addition of furfural. The mechanical properties (i.e., modulus of rupture and elasticity, internal bonding strength) of boards increased with increasing board density and met the requirement for 15 type medium-density fiberboard (MDF) by JIS A 5905-1994. Thickness swelling and water absorption of boards exceeded the maximum permitted levels for 15 type MDF and S20 grade hardboard by JIS A 5905-1994, which indicates the low water-resistant property of binderless boards. In contrast to that in usual wood-based materials, internal bonding strength showed significant correlations with other board properties: modulus of rupture and elasticity, thickness swelling, and water absorption. We confirmed experimentally that the best manufacturing conditions proved to be as follows: pressing temperature 180°C, time 10min; pressing pressure 5.3MPa; board thickness 5mm; board density 1.0g/cm³; average grain size 53µm; and powder with no furfural content.Part of this paper was presented at the 52nd Annual Meeting of the Japan Wood Research Society, Gifu, April 2002     

Bond durability of kenaf core binderless boards I: two-cycle accelerated aging boil test

A two-cycle accelerated aging boil test was conducted on kenaf core binderless boards to estimate their bond durability. This is one of the methods to estimate the bond quality of kenaf core binderless boards, as stipulated by Notification 1539 of the Ministry of Land, Infrastructure, and Transport, October 15, 2001, for the Building Standard Law of Japan. Generally, retention ratios of modulus of rupture (MOR), modulus of elasticity (MOE), and internal bond (IB) strength after the boil test increased with increased pressing temperature. In particular, the MOR retention ratio of boards with a pressing temperature of 200°C (average 106.4%) was higher than that of a commercial medium-density fiberboard (MDF) (melamine-urea-formaldehyde resin) (average 72.7%), and the value sometimes exceeded 100%. The durability of kenaf core binderless boards with a pressing temperature of 200°C compared favorably with that of the commercial MDF (melamine-urea-formaldehyde resin), having almost the same retained strength values after the boil test. Part of this article was presented at the International Symposium on Wood Science and Technology, IAWPS2005, November 27–30, 2005, Yokohama, Japan     

Bond durability of kenaf core binderless boards II: outdoor exposure test

An outdoor exposure test was conducted on kenaf core binderless boards (pressing temperatures 200°, 180°, and 160°C; pressing pressure 3.0 MPa, time 10 min, target board thickness 5 mm, target board density 0.8 g/cm³) to estimate their bond durability. Modulus of rupture (MOR), modulus of elasticity (MOE), internal bonding strength (IB), thickness change, weight loss, Fourier transform infrared (FTIR) spectra, and color difference (ΔE*) by the CIE L^*a^*b^* system were measured at various outdoor exposure periods up to 19 months. These values were then compared with those of a commercial medium-density fiberboard (MDF; melamine-urea-formaldehyde resin; thickness 9.0 mm, density 0.75 g/cm³). Generally, dimensional stability and the retention ratios of MOR, MOE, and IB after the outdoor exposure test increased with increased pressing temperature of binderless boards. The MOR retention ratio of the kenaf core binderless boards with a pressing temperature of 200°C was 59.5% after 12 months of outdoor exposure, which was slightly lower than that of the MDF (75.6% after 11 months of outdoor exposure). Despite this, the bond durability of the kenaf core binderless boards should be viewed as favorable, especially when considering the fact that the retention ratio of 59.5% was achieved without binder and without obvious element loss. Part of this report was presented at the International Symposium on Wood Science and Technology, IAWPS2005, November 27-30, 2005, Yokohama, Japan     

Development of binderless particleboard from kenaf core using steam-injection pressing

Binderless particleboards were successfully developed from kenaf core using the steam-injection press. The effects of board density, steam pressure, and treatment time on the properties of the board were evaluated. The target board densities were relatively low, ranging from 0.40 to 0.70g/cm³. The properties [i.e., moduli of rupture (MOR) and elasticity (MOE) in both dry and wet conditions, internal bonding strength (IB), and water absorption (WA)] of the boards increased linearly with increasing board density. Steam pressure and treatment time also affected the board properties. The bending strength and IB were improved with increased steam pressure. A long steam treatment time contributed to low thickness swelling (TS) values and thus better dimensional stability. The appropriate steam pressure was 1.0MPa, and the treatment time was 10–15min. The properties for 0.55g/cm³ density boards under optimum conditions were MOR 12.6MPa, MOE 2.5GPa, IB 0.49MPa, TS 7.5%, and wet MOR 2.4MPa. Compared with the requirement of JIS 5908, 1994 for particleboard, kenaf binderless boards showed excellent IB strength but relatively poor durability.Part of this report was presented at the 19th Annual Meeting of the Japan Wood Technological Association, Tokyo, October 2001     

Chemical changes in steam-pressed kenaf core binderless particleboard

The effects of chemical changes in kenaf core binderless particleboards on the bonding performance and thickness swelling of boards were investigated by chemical and spectroscopic analyses. Mild steam-injection treatments (0.6–1.0MPa) caused significant degradation of hemicelluloses, lignin, and cellulose. Conventional hot pressing caused a lower degree of degradation of the chemical components. The hot-pressed kenaf core board without any binders showed poor bonding performance. Thus, it was found that partial degradation of the three major chemical components of the kenaf core by mild steam-injection treatment increased the bonding performance and dimensional stability of the binderless boards, and gave better quality binderless boards than those made by hot-pressing treatments.Part of this report was presented at the 4th International Wood Science Symposium, Serpong, Indonesia, September 2002; and at the 53rd Annual Meeting of The Japan Wood Research Society, Fukuoka, March 2003     

Chemical changes of kenaf core binderless boards during hot pressing (II): effects on the binderless board properties

To provide basic information on self-bonding in kenaf core binderless boards, a series of chemical analyses was conducted on binderless boards and their chemical changes during hot pressing were examined in our previous study. In this study, binderless boards were manufactured under conditions that may accelerate the supposed chemical changes to investigate their effect on the board properties. First, to investigate the influence of the chemical bonds formed by carbonyl compounds on self-bonding, the influence of acetic acid addition prior to board manufacturing was studied and the effect of methanol extractives (containing the carbonyl compounds) was also examined. Second, the influence of the condensation reaction in lignin was discussed from the viewpoint of board density. Last, to examine the influence of thermal softening of lignin, the influences of temperature condition and moisture content, as well as those of microwave pretreatment, were investigated. As a result, the estimated chemical changes were suggested to influence the binderless board properties.     

Development of binderless fiberboard from kenaf core

Binderless fiberboards with densities of 0.3 and 0.5 g/cm³ were developed from kenaf core material using the conventional dry-manufacturing process. The effects of steam pressure (0.4–0.8 MPa) and cooking time (10–30 min) in the refining process, fiber moisture content (MC) (10%, 30%), and hot-pressing time (3–10 min) on the board properties were investigated. The results showed that kenaf core binderless fiberboards manufactured with high steam pressure and long cooking time during the refining process had high internal bond (IB) strength, low thickness swelling (TS), but low bending strength values. The binderless fiberboards made from 30% MC fibers showed better mechanical and dimensional properties than those from air-dried fibers. Hot-pressing time was found to have little effect on the IB value of the binderless board at the refining conditions of 0.8 MPa/20 min, but longer pressing time resulted in lower TS. At a density of 0.5 g/cm³, binderless fiberboard with the refining conditions of 0.8 MPa/20 min recorded a modulus of rupture (MOR) of 12 MPa, modulus of elasticity (MOE) of 1.7 GPa, IB of 0.43 MPa, and 12% TS under the optimum board manufacturing conditions. Part of this article was presented at the 54th Annual Meeting of the Japan Wood Research Society, Hokkaido, August 3–5, 2004     

Manufacture and properties of low-density binderless particleboard from kenaf core

Low-density binderless particleboards from kenaf core were successfully developed using steam injection pressing. The target board density ranged from 0.10 to 0.30g/cm³, the steam pressure used was 1.0MPa, and the steam treatment times were 7 and 10min. The mechanical properties, dimensional stability, and thermal and sound insulation performances of the boards were investigated. The results showed that the low-density kenaf binderless particleboards had good mechanical properties and dimensional stability relative to their low board densities. The board of 0.20g/cm³ density with a 10-min treatment time produced the following values: modulus of rupture 1.1MPa, modulus of elasticity 0.3GPa, internal bond strength 0.10MPa, thickness swelling in 24h water immersion 6.6%, and water absorption 355%. The thermal conductivity of the low-density kenaf binderless particleboards showed values similar to those of insulation material (i.e., rock wool), and the sound absorption coefficient was high. In addition, the boards are free from formaldehyde emission. Kenaf core appears to be a potential raw material for low-density binderless panels suitable for sound absorption and thermally resistant interior products.Part of this report was presented at the 52th Annual Meeting of the Japan Wood Research Society, Gifu, Japan, April 2002     

Chemical changes of kenaf core binderless boards during hot pressing (I): influence of the pressing temperature condition

Self-bonding is the main factor of the performance expression of binderless boards, and therefore its clarification is considered to be an important issue. For this purpose, a series of chemical analyses were conducted on kenaf core binderless boards and their chemical changes during the hot-pressing process are discussed in this article. First of all, binderless boards were prepared from kenaf core powder at different pressing temperatures (without steam-explosion process) and were used for chemical analyses after they were reduced into powders and extracted with methanol. To investigate their chemical changes, lignin, holocellulose, and neutral sugar contents were determined, Fourier transform infrared (FTIR) spectra were recorded, and the nitrobenzene oxidation procedure was applied. As a result, it was found that parts of lignin and hemicelullose were decomposed during the hot-pressing process; however, the contribution of the resulting fractions to selfbonding was not observed. In addition, progress of condensation reactions in lignin and the formation of chemical bonds by low molecular weight conjugated carbonyl compounds in methanol extractives were observed. Thermal softening of lignin is also suggested to play an important role in the expression of board performance.     

Properties of kenaf core binderless particleboard reinforced with kenaf bast fiber-woven sheets

Kenaf composite panels were developed using kenaf bast fiber-woven sheets as top and bottom surfaces, and kenaf core particles as core material. During board manufacture, no binder was added to the core particles, while methylene diphenyldiisocyanate resin was sprayed to the kenaf bast fiber-woven sheet at 50 g/m² on a solids basis. The kenaf composite panels were made using a one-step steam-injection pressing method and a two-step pressing method (the particleboard is steam pressed first, followed by overlaying). Apart from the slightly higher thickness swelling (TS) values for the two-step panels when compared with the one-step panels, there was little difference in board properties between the two composite panel types. However, the two-step pressing operation is recommended when making high-density composite panels (>0.45 g/cm³) to avoid delamination. Compared with single-layer binderless particleboard, the bending strengths in dry and wet conditions, and the dimensional stability in the plane direction of composite panels were improved, especially at low densities. The kenaf composite panel recorded an internal bond strength (IB) value that was slightly low because of the decrease of core region density. The kenaf composite panel with a density of 0.45 g/cm³ (one-step) gave the mechanical properties of: dry modulus of rupture (MOR) 14.5 MPa, dry modulus of elasticity (MOE) 2.1 GPa, wet MOR 2.8 MPa, IB 0.27 MPa, TS 13.9%, and linear expansion 0.23%.     

Development of boards made from oil palm frond II: properties of binderless boards from steam-exploded fibers of oil palm frond

Binderless boards were prepared from steam-exploded fiber of oil palm(Elaeis guineensis Jacq.) frond at six levels of explosion conditions. Their properties were investigated and evaluated. The mechanical properties (i.e., modulus of rupture, modulus of elasticity, and internal bonding strength) of the boards increased linearly with increasing board density as the usual hardboard. The boards made from fibers treated under a steam explosion condition of 25 kgf/cm² (steam pressure) and 5 min (digestion period) exhibited the maximum strength. These boards at a density of 1.2 g/cm³ met the requirement of S-20 grade of JIS A 5905 — 1994 (fiberboard). Thickness swelling of the boards ranged from 6% to 14% under the JIS A 5908 — 1994 (particleboard) test condition and showed no significant changes with increasing board density. The main bonding strength of the board is believed to be due to a ligninfurfural linkage. Considering the chemical components of oil palm frond, which is rich in hemicellulose, there seems to be a good possibility for producing binderless boards using steam-exploded fibers of oil palm frond.This study was presented in part at the 2nd International Wood Science Seminar, Serpong, Indonesia, November 1998     

Manufacture of plywood bonded with kenaf core powder

Kenaf (Hibiscus cannabinus L.) core powder was used as a binder to manufacture three-ply plywoods of sugi (Cryptomeria japonica D. Don) by conventional hot pressing under various manufacturing conditions: hot-pressing conditions (pressure, temperature, and time) and powder conditions (grain size, spread volume, and moisture content). The adhesive shear strength and wood failure of plywoods were measured in accordance with the Japanese Agricultural Standard (JAS) for plywood. The result showed that fine kenaf core powder played a role as an effective binder when plywoods were pressed at high pressure, which caused extreme compression of veneer cells. In addition, the adhesive shear strength of plywoods in dry conditions was high regardless of pressing temperature and time, but it was sensitive to pressing temperature and time in wet conditions. The highest adhesive shear strength was obtained from plywoods manufactured with kenaf core powder (grain size 10 μm, spread volume 200 g/m², moisture content 8.6%) under hot-pressing conditions (pressure 5.0 MPa using distance bars 4 mm thick, temperature 200°C, time 20–30 min). However, the plywood could not meet the requirement for the second grade of plywood by JAS because of its low water-resistance properties. Part of this article was presented at the 58th Annual Meeting of the Japan Wood Research Society, Tsukuba, March 2008, and the 10th World Conference on Timber Engineering, Miyazaki, June 2008     

Strength,decay and termite resistance of oriented kenaf fiberboards

The development of oriented fiberboards made from kenaf (Hibiscus cannabinus L.) and their suitability as a construction material has been investigated. Three different types of boards consisting of five layers with individual orientations were prepared using a combination of low molecular weight and high molecular weight phenol-formaldehyde (PF) resin for impregnation and adhesion purposes. Additional boards with the same structure were prepared using high molecular weight PF resin only. The mechanical properties of the boards have been examined as well as their resistance against fungal decay and termite attack. All kenaf fiberboards showed elevated mechanical properties compared with medium-density fiberboard made from wood fibers, and showed increased decay and termite resistance. Differences in the decay and termite resistance between the board types were caused by the presence of the low molecular weight PF resin for the impregnation of the fibers. No significant difference was found for the mechanical properties. The effect of the PF resin for impregnation was much clearer in fungal decay resistance than for termite resistance; however, fiber orientation had no effect on both decay and termite resistance of the specimens.     

Manufacture and properties of binderless particleboard from bagasse I: effects of raw material type, storage methods, and manufacturing process

Binderless particleboards were manufactured from sugarcane (Saccharum officinarum L.) bagasse by steam-injection pressing and by using hot pressing as a reference method. The inner layer (core/pith) and the outer hard fibrous layer (face/rind) of bagasse were used as raw materials. The effects of bagasse type, manufacturing process, and storage method on the mechanical properties of binderless particleboards were investigated. The results showed that the bagasse pith particles provided better board properties than bagasse rind particles. It seemed that bagasse pith particles were more easily deformed than bagasse rind particles, enlarging the bonding contact area. The severe conditions of steam-injection pressing caused delamination on the bagasse pith binderless boards with densities of 0.6 g/cm³ or higher, and gave poor bonding quality. However, steam-pressed boards showed relatively higher board properties than hot-pressed boards. The storage method of sugarcane bagasse affected the chemical composition and the board properties. It was shown that the extent of self-bonding formation depends on the chemical and morphological properties of lignocellulosic materials, as well as on the manufacturing conditions. Part of this paper was presented at the 5th International Wood Science Symposium, Kyoto, Japan, September 2004     

Influence of the chemical composition of kenaf bast and core on the alkaline pulping response

The bast and core of kenaf,Hibiscus cannabinus L., have markedly different chemical components and alkaline cooking responses. The bast had about double the hot-water extractives content and only about half the lignin content of the core. The core contained a large amount of hemicellulose, mostly composed of xylan. The lignin structures of bast and core were also quite different: The former had a significant abundance of syringyl structures. Evidence showed that the bast was much more easily delignified than the core. When the bast and core were cooked together in alkaline condition, the pulp yields at the same kappa number were higher than those of the individual pulpings of bast and core. The bast-core pulping gave a positive effect on the yield of bast pulp in the sodaanthraquinone and kraft pulpings. On the other hand, kenaf was abundant in the hot water extractives. These extractives consumed alkali during cooking to a relatively large extent but acted as a protector of hemicellulose and slightly increased the pulp yields.Part of this paper was presented at the 48th and 49th Annual Meetings of the Japan Wood Research Society, Shizuoka, April 3–5, 1998 and Tokyo, April 3–5, 1999     

Fire resistance of thick wood-based boards

Thick wood-based boards are used as construction materials for walls and floors in Japan. In this study, fire resistance tests (ISO 834-1) and cone calorimeter tests (ISO 5660-1) were conducted for thick plywood, particleboard, and medium density fiberboard with sample thicknesses of about 28–30mm, and their suitabilities for quasi-fireproof or fire-preventive structures were evaluated. In the ISO 834-1 fire resistance test, the heat-shielding performance (insulation criterion) for walls was evaluated and the results showed that the larger the apparent density of a woodbased board, the higher its insulation performance. The insulation performance of thick wood-based boards in the fire resistance test could be forecast from the results of the cone calorimeter test, especially when the second peak of heat release rate appeared. In the cone calorimeter tests, the surface layer density of the plywood, particleboard, and medium density fiberboard was the dominant parameter for the time to ignition and initial heat release rate. These results indicate that thick wood-based board is a suitable fire-preventive construction material. Part of this study was presented at the Annual Meeting of the Architectural Institute of Japan, Hokkaido, Japan, August 2004     

Effects of five additive materials on mechanical and dimensional properties of wood cement-bonded boards

There is a growing desire to improve the properties and use of nonwood plant materials as supplements to wood materials for wood cement-bonded boards (WCBs). This study was conducted to determine the comparative properties of WCBs containing various amounts of discontinuous inorganic fiber materials, such as alkali-resistant glass fiber, normal glass fiber, mineral wool, and nonwood plant materials such as retted flax straw and wheat straw particles. Tested cement-bonded boards were made at wood/additive compositions of 100/0, 90/10, 80/20, 70/30, 60/40, and 50/50 (weight percentages). Seventy-eight laboratory-scale WCBs were produced. Various board properties, such as the modulus of rupture (MOR), internal bonding strength (IB), water absorption (WA), thickness swelling (TS), and linear expansion (LE), were studied. The test results showed that three types of discontinuous inorganic fiber used as reinforcing materials in composites significantly enhanced and modified the performance of WCBs. The mechanical properties and dimensional stability of cement-bonded board were significantly improved with increasing amounts of the additives. MOR and IB were increased; and WA, TS, and LE of boards were reduced by combination with the inorganic fiber materials. The results also indicated that combination with retted flax straw particles only slightly increased the MOR of boards, and wheat straw particles led to marked decreases in all the mechanical properties and the dimensional stability of WCBs.Part of this report was presented at the 50th Annual Meeting of the Japan Wood Research Society, Kyoto, April 2000     

阻尼抗振型PCB用覆铜胶合板的介电特性

开发木质印制电路板(PCB)有助于提高电子产品的可降解性。采用含废旧橡胶粉的酚醛树脂压制3层胶合板,再运用FR-4半固化片覆铜箔试制了PCB用覆铜胶合板,测试和评估了构成单元及整体的介电性能。结果表明,阻尼抗振型覆铜胶合板具有优异的介电性能,可作为新型可降解PCB基板的材料;覆铜胶合板整体的介电性能与构成单元的材料和厚度参数等密切相关,根据两者的相关模型开展覆铜胶合板定向设计是可行的。     

麦秸/塑料复合材料的耐水性能研究

研究了麦秸与塑料的比例、麦秸粉末的粗细,以及塑料种类对麦秸/塑料复合材料耐水性能的影响,并且用差示扫描量热法(DSC)测定和分析了乙烯-醋酸乙烯(EVA)、聚乙烯(PE)、聚氯乙烯(PVC)塑料与麦秸之间的热反应特征。试验结果表明:麦秸/塑料复合材料具有良好的耐水性能;麦秸与聚乙烯、聚氯乙烯和乙烯-醋酸乙烯塑料之间产生了一定的反应。