Creep in chipboard

Summary A considerable amount of data has been collected over the past few years on the rupture life of particleboard. This information is particularly valuable at the present time because there is increasing interest in the use of particleboard as a structural material. This paper presents a conventional analysis of the time to failure of three commercially available brands of particleboard at 20°C and at three fixed levels of relative humidity. A linear relationship is assumed between the logarithm of time to failure and stress level, and an improvement is made in the usual method of analysis by including censored specimens. The regression lines are projected forward to give estimates of the stress levels that can be sustained for a particular design life. It is found that the regression lines for 30 per cent and 65 per cent rh may be combined, but the specimens at 90 per cent rh are significantly lower in strength at any given time. One of the MUF bonded boards performs significantly better than a second MUF board over the long term, and this gives added weight to the view that there are other factors in the make-up and production of the board that are at least as important as the resin type itself.