| Computation of Three-Dimensional Temperature Distribution and Thermal Analysis to Integrated Circuit Substrates |
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| 作者姓名： | Ding Xiaojian Xin Mindao Chen Weiyun |
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| 作者单位： | Ding Xiaojian;Xin Mindao;Chen Weiyun |
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| 摘 要： | The exact three di me nsional temperatu re distribution and thermal analysiS to inte-grated circuit substrates have been presen ted by means of numerical method of a fin ite difference.Thismethed.which will overcome the di fficuItv of mathematical deduction mav be consltieredas an analytical way aided by com puters for thermal design of electron ic compon ents.
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| 关 键 词： | numerical analysis local heat source temperatme distribution thermal design |
Computation of Three-Dimensional Temperature Distribution and Thermal Analysis to Integrated Circuit Substrates |
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| Ding Xiaojian,Xin Mindao,Chen Weiyun.Computation of Three-Dimensional Temperature Distribution and Thermal Analysis to Integrated Circuit Substrates[J].Storage & Process,1994(6):19-23. |
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| Authors: | Ding Xiaojian Xin Mindao Chen Weiyun |
| |
| Institution: | Ding Xiaojian;Xin Mindao;Chen Weiyun |
| |
| Abstract: | The exact three di me nsional temperatu re distribution and thermal analysiS to inte-grated circuit substrates have been presen ted by means of numerical method of a fin ite difference.Thismethed.which will overcome the di fficuItv of mathematical deduction mav be consltieredas an analytical way aided by com puters for thermal design of electron ic compon ents. |
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| Keywords: | numerical analysis local heat source temperatme distribution thermal design |
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