Suppression of conidial germination and appressorial formation by silicate treatment in powdery mildew of strawberry |
| |
Authors: | Takeshi Kanto Kazumasa Maekawa Masataka Aino |
| |
Affiliation: | (1) Hyogo Prefectural Technology Center for Agriculture, Forestry and Fisheries, 1533 Befu-cho, Kasai Hyogo, 679-0198, Japan |
| |
Abstract: | ![]() The mode of action of soluble silicon against strawberry powdery mildew (Sphaerotheca aphanis var. aphanis) was investigated in four experiments. First, silicon-treated leaves from plants grown with silicate (Si+) and control leaves were excised, inoculated with conidia, and subsequent germination and formation of appressoria in a petri dish was assessed after 24 h. The germination rate was 49.7% on Si+ leaves, and was 67.2% on control leaves (t-test, P < 0.01). Second, we soaked cellulose membranes in various solvents and then placed the membranes on 4% water agar, dusted the membranes with conidia, and examined after 12 h. No difference was apparent between any treatment and the control (distilled water). Third, strawberries growing hydroponically with additional silicon in the medium were inoculated with conidia, and leaves were observed with a scanning electron microscope 1–2 days after inoculation. Germ tubes and secondary hyphae were shorter and had fewer branches on Si+ leaves than on the control. Moreover, penetration appeared to be inhibited. Fourth, the cuticle was separated from leaves from plants grown as in the third experiment, placed on water agar, and dusted with conidia. Germination of conidia, observed with a light microscope, on Si+ leaves was suppressed markedly to 40%–60% of that of the control. These results suggested that soluble silicon induced physiological changes in the cuticle layer after absorption by the plant. In addition, soluble silicate reduced germination of conidia, formation of appressoria, and possibly the penetration of powdery mildew. |
| |
Keywords: | Strawberry powdery mildew Liquid potassium silicate Conidial germination Cuticle |
本文献已被 SpringerLink 等数据库收录! |
|