麦秆/SPI润湿性和X射线光电子能谱分析(英文)

[目的]为了改善麦秆表面胶接性能以制备大豆分离蛋白胶黏剂麦秆刨花板,分别对麦秆表面进行化学处理和酶处理。[方法]通过接触角测量和计算扩散-渗透系数(K),对未处理(对照试样)和两种化学处理及三种酶处理麦秆的麦秆表面润湿性进行评价分析,并通过X射线光电子能谱(XPS)对处理试样和对照试样进行表面元素分析。[结果]结果表明氢氧化钠处理、过氧化氢处理以及脂肪酶处理后的麦秆表面扩散-渗透系数K值同对照试样相比,分别提高了58.0%,48.7%和83.2%。XPS分析表明处理后的麦秆表面硅元素含量的急剧减少和蜡质层的破坏都为麦秆表面润湿性的改善起到了很重要的作用。[结论]麦秆化学处理和脂肪酶处理为豆胶麦秆刨花板的制备提供了技术支持。

Analysis of Wettability and X-ray Photoelectron Spectroscopy of Wheat Straw/SPI

[Objective] The aim was to improve the adhesive bonding property of wheat straw surface to prepare wheat straw particleboard of soy protein isolate(SPI) adhesive through chemical and enzyme treatments.[Method] Evaluation and analysis were made on wettability of wheat straws in the control group and treated groups(chemical and enzyme treatments) by means of measurement of contact angle and calculation of spreading-penetration parameters(K).In addition,we made analysis on surface elements through X-ray photoelectron spectroscopy(XPS).[Result] The results showed that K value of straw treated with sodium hydroxide,hydrogen peroxide and lipase increased by 58.0%,48.7% and 83.2% compared to that of control group,respectively.The XPS analysis indicated that rapid decrease of silicon content and destruction of wax layer greatly contributed to wettability improvement of wheat straw surface.[Conclusion] The chemical and lipase treatments of wheat straw provided technical support for manufacture of wheat straw particle boand.