| Numerical Simulation of Temperature Field during the Dissolution-Diffusion Bonding Process to Mending Iron Casting Defects |
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| 作者姓名： | Cheng Xinming Qian Hancheng |
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| 作者单位： | Cheng Xinming;Qian Hancheng |
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| 摘 要： | The common finite element method microcomputer software for simulation of the temperature field is developed by authors. It is used for calculating the temperature field duringthe mending process of iron casting defects by means of the dissolution-diffusion bonding technology. The correctness has been proved by testing results. This software has been used to analyse thecaused of hardness rising in heat effecting zone,and also find out the approach for solving the problem.
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| 关 键 词： | s:finite element methods numerical simulation temperature field/dissolutiondiffusion bonding casting defects |
Numerical Simulation of Temperature Field during the Dissolution-Diffusion Bonding Process to Mending Iron Casting Defects |
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| Cheng Xinming,Qian Hancheng.Numerical Simulation of Temperature Field during the Dissolution-Diffusion Bonding Process to Mending Iron Casting Defects[J].Storage & Process,1996(4):71-76. |
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| Authors: | Cheng Xinming Qian Hancheng |
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| Institution: | Cheng Xinming;Qian Hancheng |
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| Abstract: | The common finite element method microcomputer software for simulation of the temperature field is developed by authors. It is used for calculating the temperature field duringthe mending process of iron casting defects by means of the dissolution-diffusion bonding technology. The correctness has been proved by testing results. This software has been used to analyse thecaused of hardness rising in heat effecting zone,and also find out the approach for solving the problem. |
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| Keywords: | s:finite element methods numerical simulation temperature field/dissolutiondiffusion bonding casting defects |
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