首页 | 本学科首页   官方微博 | 高级检索  
     检索      


Changes in micropores in dry wood with elapsed time in the environment
Authors:Keisuke Kojiro  Yuzo Furuta  Makoto Ohkoshi  Yutaka Ishimaru  Misao Yokoyama  Junji Sugiyama  Shuichi Kawai  Takumi Mitsutani  Hiromasa Ozaki  Minoru Sakamoto  Mineo Imamura
Institution:1. Advanced Wood-Based Material Technology Group, Materials Research Institute for Sustainable Development, National Institute of Advanced Industrial Science and Technology (AIST), 2266-98 Anagahora, Shimoshidami, Moriyama-ku, Nagoya, 463-8560, Japan
2. Graduate School of Life and Environmental Sciences, Kyoto Prefectural University, Kyoto, 606-8522, Japan
3. Research Institute for Sustainable Humanosphere, Kyoto University, Uji, 611-0011, Japan
4. Nara National Research Institute for Cultural Properties, Nara, 630-8577, Japan
5. National Museum of Japanese History, Sakura, 285-8502, Japan
Abstract:To investigate the changes in microstructures of wood with elapsed time in the environment, CO2 adsorption onto dry wood was measured at ice-water temperature (273 K) for samples aged from 0.1 years to over 1000 years. The micropore size distribution was obtained using the Horvath-Kawazoe method. Micropores smaller than 0.6 nm in wood decreased in number with elapsed time in the environment, and a negative correlation was found between cumulative pore volume for pores smaller than 0.6 nm and elapsed time in the environment. Cumulative pore volume in the 1000-year sample was almost half of that in the 0.1- year sample. Micropores smaller than 0.6 nm in wood with a few decades or more of elapsed time increased in number after rewetting and drying. Consequently, microstructures of wood with longer time elapsed in the environment were considered to be more stable, because of longer-term thermal motion and possibly more repeated moisture adsorption and desorption and/or temperature variation in the environment.
Keywords:Unstable state  Micropore structure  HK method  Old wood  Elapsed time
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号