Performance of particleboard manufactured using air-injection press I: effects of air-injection press on preventing blowout of board manufactured from low-moisture particles

An air-injection press (AIP) was developed to prevent accidental blowouts of boards during production. In this study, the effects of the AIP on preventing blowouts were investigated by artificially creating a blowout-prone condition, and the press was shown to be effective in preventing blowouts. The modulus of rupture of the boards was almost constant irrespective of pressing time. Longer pressing time resulted in higher internal bond strength when pressed at 170 °C. The thickness swelling of the boards pressed at 170 or 190 °C was almost uniform irrespective of pressing time, and the manufactured boards showed performance similar to those manufactured with an ordinary press. The AIP prevented blowouts sufficiently even when the pressure of the injected air was reduced, and this reduction did not adversely decrease the performance of the boards. Air injection reduced formaldehyde emissions from the board.     

Dimensional stabilization of compressed laminated veneer lumber by hot pressing in an airtight frame

Abstract

The purpose of this study was to evaluate the dimensional stability and strength properties of compressed laminated veneer lumber (LVL) produced using a closed hot pressing system. LVL specimens were produced with varying number of veneers using either diphenylmethane diisocyanate (MDI) or a water-soluble phenol formaldehyde (PF) resin at varying temperatures (160–200°C), pressures (0.5–3 MPa) and hot-pressing times (2–16 min). Results show that the heating process decreases the recovery of compressive deformation in the veneers when subjected to cyclic moisture and heat conditions. Thickness swelling was approximately 5% after a drying, wetting and boiling cyclic test for LVL using the MDI resin and hot pressed at 200°C for 8 min. Modulus of elasticity and rupture increased for samples produced in both an open press and the closed press with an increase in the number of veneers and density, as did the absorbed energy in impact bending.     

Bond durability of kenaf core binderless boards II: outdoor exposure test

An outdoor exposure test was conducted on kenaf core binderless boards (pressing temperatures 200°, 180°, and 160°C; pressing pressure 3.0 MPa, time 10 min, target board thickness 5 mm, target board density 0.8 g/cm³) to estimate their bond durability. Modulus of rupture (MOR), modulus of elasticity (MOE), internal bonding strength (IB), thickness change, weight loss, Fourier transform infrared (FTIR) spectra, and color difference (ΔE*) by the CIE L^*a^*b^* system were measured at various outdoor exposure periods up to 19 months. These values were then compared with those of a commercial medium-density fiberboard (MDF; melamine-urea-formaldehyde resin; thickness 9.0 mm, density 0.75 g/cm³). Generally, dimensional stability and the retention ratios of MOR, MOE, and IB after the outdoor exposure test increased with increased pressing temperature of binderless boards. The MOR retention ratio of the kenaf core binderless boards with a pressing temperature of 200°C was 59.5% after 12 months of outdoor exposure, which was slightly lower than that of the MDF (75.6% after 11 months of outdoor exposure). Despite this, the bond durability of the kenaf core binderless boards should be viewed as favorable, especially when considering the fact that the retention ratio of 59.5% was achieved without binder and without obvious element loss. Part of this report was presented at the International Symposium on Wood Science and Technology, IAWPS2005, November 27-30, 2005, Yokohama, Japan     

Evaluation of the self-bonding ability of sugi and application of sugi powder as a binder for plywood

Binderless particleboards were manufactured from sugi (Cryptomeria japonica D. Don) heartwood and sapwood by hot-pressing (pressure: 5 MPa; temperatures: 180°, 200°, and 220°C; times: 10, 20, and 30 min), and the board properties [internal bonding (IB), thickness swelling (TS), water absorption (WA)] were investigated to evaluate the self-bonding ability. The IB, TS, and WA of the boards from sugi heartwood were better than those of the boards from sugi sapwood at any hot-pressing condition. Therefore, it was suggested that the self-bonding ability of sugi heartwood was superior to that of sugi sapwood. Then, sugi heartwood and sapwood powder with grain size 10 βm were used as a binder for plywoods. Four kinds of plywood were manufactured from the combination of powder and veneer, both of which were prepared from sugi heartwood and sapwood under the same hot-pressing conditions as the binderless particleboard, and the adhesive shear strength and wood failure of the plywood were investigated. As a result, the plywood composed of sugi heartwood veneer met the second grade of JAS for plywood, when either powder was used as a binder, when they were pressed at 200°C for 20–30 min and 220°C for 10 min.     

Compressive deformation of wood impregnated with low molecular weight phenol formaldehyde (PF) resin V: effects of steam pretreatment

This study evaluated the potential of steam pre-treatment for making highly compressed phenol-formaldehyde (PF) resin-impregnated wood at a low pressing pressure. Sawn veneers of Japanese cedar (Cryptomeria japonica) were first subjected to saturated steam at different steaming temperatures (140°-200°C), followed by impregnation with a 20% low molecular weight PF resin aqueous solution resulting in a weight gain of around 50%-55%. Four oven-dried treated veneers were laminated and compressed up to a pressing pressure of 1 MPa at a pressing temperature of 150°C and pressing speed of 5 mm/min, and the pressure was held for 30 min. Steam treatment, causing partial hydrolysis of hemicellulose, accelerated the compressibility of Japanese cedar in the PF resin-swollen condition. As a consequence, a discernible increment in density was achieved at a pressing pressure of 1 MPa due to steam pretreatment between 140° and 200°C for 10 min. It was also found that even a short steaming time such as 2 min at 160°C is sufficient for obtaining appreciable compression of PF resin-impregnated wood. The density, Young’s modulus, and bending strength of steam-treated (200°C for 10 min) PF resin-impregnated wood composite reached 1.09 g/cm³, 20 GPa, and 207MPa, respectively. In contrast, the values of untreated PF resin-impregnated wood composite were 0.87 g/cm³, 13 GPa, and 170MPa, respectively.     

Bond durability of kenaf core binderless boards I: two-cycle accelerated aging boil test

A two-cycle accelerated aging boil test was conducted on kenaf core binderless boards to estimate their bond durability. This is one of the methods to estimate the bond quality of kenaf core binderless boards, as stipulated by Notification 1539 of the Ministry of Land, Infrastructure, and Transport, October 15, 2001, for the Building Standard Law of Japan. Generally, retention ratios of modulus of rupture (MOR), modulus of elasticity (MOE), and internal bond (IB) strength after the boil test increased with increased pressing temperature. In particular, the MOR retention ratio of boards with a pressing temperature of 200°C (average 106.4%) was higher than that of a commercial medium-density fiberboard (MDF) (melamine-urea-formaldehyde resin) (average 72.7%), and the value sometimes exceeded 100%. The durability of kenaf core binderless boards with a pressing temperature of 200°C compared favorably with that of the commercial MDF (melamine-urea-formaldehyde resin), having almost the same retained strength values after the boil test. Part of this article was presented at the International Symposium on Wood Science and Technology, IAWPS2005, November 27–30, 2005, Yokohama, Japan     

Water resistance properties of kenaf core binderless boards

Abstract Binderless boards were prepared from kenaf core under various manufacturing conditions and their water resistance properties were evaluated. The board properties evaluated were retention ratios of modulus of rupture (MOR) and modulus of elasticity (MOE), internal bonding strength after water treatment (IB), thickness swelling (TS), water absorption (WA), and linear expansion (LE). These values were then compared with those of boards bonded with urea-formaldehyde (UF), urea melamine formaldehyde (UMF), and phenol-formaldehyde (PF) resins, and their water resistance properties were assessed. We found that pressing temperature was one of the most important conditions for the improvement of water resistance properties. The retention ratios of MOR, MOE, and IB of kenaf core chip binderless boards (pressing temperature 200°C, target density 0.8g/cm³, and the three-step pressing of 6MPa for 10min, then 4MPa for 3min, and 2MPa for 3min) were 37.1%, 49.9%, and 55.7%, respectively, compared with values for UMF-bonded boards of 22.5%, 27.1%, and 40.7%, and values for PF-bonded boards of 42.8%, 41.8%, and 54.1%, respectively. The results showed that the water resistance properties of binderless boards were higher than those of UMF-bonded boards and almost as high as those of PF-bonded boards. Part of this article was presented at the 53rd Annual Meeting of the Japan Wood Research Society, Fukuoka, March 2003     

Performance of particleboard manufactured using air-injection press II: effects of board density and thickness on the performance of board manufactured from low-moisture particles

Particleboards of different densities (0.6, 0.7 and 0.8 g/cm³) and thicknesses (10 and 20 mm) were manufactured from low-moisture particles using an air-injection press. The effects of the air injection on preventing blowout of the boards of different densities and thicknesses were investigated by artificially creating blowout-prone conditions using metal frames. The effects of the air-injection pressure on the board performance were also investigated. 10-mm-thick boards of 0.8 g/cm³ pressed at 170 °C blew out when air was not injected, but were successfully manufactured by injecting air. 10-mm-thick boards at 150 °C showed constant internal bond (IB), regardless of density, but at 170 °C, IB was higher in boards of higher densities. This was likely due to accelerated hardening of the urea–formaldehyde resin at 170 than 150 °C. At both pressing temperatures, low air-injection pressure did not cause blowout and a reduction in board performance. Air injection also prevented the blowout of thick boards of 20 mm and enabled successful manufacture, showing its effectiveness. The IB of the 20-mm-thick board manufactured using the air-injection press exceeded that of 20-mm-thick board manufactured using an ordinary hot press.     

Properties of particleboard manufactured using an air-injection radio-frequency hot press

A hot press was used to manufacture particleboards (H boards). A radio-frequency hot press (for RH boards) and an air-injection radio-frequency hot press (for ARH board) were also used, and the effects of air injection on preventing blowout and board properties were analyzed. The thicknesses and densities of manufactured boards were 10 and 30 mm, and 0.6, 0.7, and 0.8 g/cm³, respectively. The investigation ascertained the effects of air injection in preventing blowout when a radio-frequency hot press is used. The increasing order of temperature was ARH board > RH board > H board during the final pressing stage. For the 30-mm-thick boards, the temperature of H board increased to 100 °C and remained constant at 100 °C even when the pressing time was extended. The temperature of the RH board increased to 100 °C more quickly than in the case of the H board and remained constant at 110–118 °C. The temperature of the ARH board increased linearly to 130–142 °C. For both the 10- and 30-mm-thick boards, the internal bond strength of the RH board was almost the same as that of the ARH board at densities of 0.6 and 0.7 g/cm³. In contrast, the internal bond strength of the RH board was lower than that of the ARH board at a density of 0.8 g/cm³. For the 10-mm-thick boards, the thickness swelling in the RH board was almost the same as that in the ARH board irrespective of the density. However, for the 30-mm-thick boards, the thickness swelling in the RH board was higher than that in the ARH board. The low plasticization of particles due to air injection presumably results in a high degree of thickness swelling.     

Characterization of bagasse binderless particleboard manufactured in high-temperature range

This paper describes the features of binderless particleboard manufactured from sugarcane bagasse, under a high pressing temperature of 200–280 °C. Mechanical properties [i.e., modulus of rupture (MOR) and elasticity (MOE) in dry and wet conditions, internal bonding strength (IB)] and dimensional stability [i.e., thickness swelling (TS)] of the board were evaluated to investigate the effect of high pressing temperature. Recycled chip binderless particleboards were manufactured under the same conditions for comparison, and particleboards bonded with polymeric methylene diphenyl diisocyanate (PMDI) resin were manufactured as reference material. The target density was 0.8 g/cm³ for all of the boards. The results showed that the mechanical properties and dimensional stability of both types of binderless boards were improved by increasing the pressing temperature. Bagasse showed better performance than that of recycled chip as a raw material in all evaluations. Bagasse binderless particleboard manufactured at 260 °C had an MOE value of 3.5 GPa, which was equivalent to the PMDI particleboard, and a lower TS value of 3.7 % than that of PMDI particleboard. The MOR retention ratio under the dry and wet conditions was 87.0 %, while the ratio for the PMDI particleboard was only 54.6 %. The obtained results showed the possibility of manufacturing high-durability binderless particleboard, with good dimensional stability and water resistance, which previously were points of weakness for binderless boards. Manufacturing binderless boards under high temperature was effective even when using particles with poor contact area, and it was possible to express acceptable properties to allow the manufacture of particleboards. Further chemical analysis indicated a contribution of a saccharide in the bagasse to the improvement of the board properties.     

Effects of heat treatment on some properties of MDF (medium-density fiberboard)

This work investigated some mechanical, physical and free formaldehyde emission properties of heat-treated MDF. For this purpose, MDF panels were subjected to varying heat treatment temperatures (155°C, 165°C and 175°C), durations (2.5?h., 3.5?h. and 4.5?h.) and waiting times after hot pressing (30?min., 120?min. and 600?min). Thickness swelling (TS), water absorption (WA), free formaldehyde emission (FFE), bending strength (BS), modulus of elasticity (MOE), tensile strength perpendicular to fibers (TSPF) for treated and untreated samples were tested and evaluated statistically. Consequently, after the heat treatment values of tensile strength, bending strength and modulus of elasticity were almost negatively affected relatively, but the thickness swelling and water absorption and quantities of free formaldehyde were improved positively of MDF samples.     

Development of an air-injection press for preventing blowout of particleboard (III): effects of pressing temperature on board performance

An air-injection press, which has holes punched in the heating plates, injects high-pressure air through the holes of one plate into particleboards and discharges the air and vapor through the other plate during press heating. The press can manufacture particleboards from high-moisture particles by preventing blowouts of the boards. In this study, the effects of pressing temperature were investigated by pressing boards at 190, 210, and 230°C. The internal bond strength increased from 0.43 to 0.60?MPa by raising the temperature from 190 to 210°C, but did not increase further when the temperature was raised to 230°C. Raising the temperature from 190 to 210°C also helped improve the thickness swelling. No relationship was found between the modulus of rupture and pressing temperature.     

Manufacture of plywood bonded with kenaf core powder

Kenaf (Hibiscus cannabinus L.) core powder was used as a binder to manufacture three-ply plywoods of sugi (Cryptomeria japonica D. Don) by conventional hot pressing under various manufacturing conditions: hot-pressing conditions (pressure, temperature, and time) and powder conditions (grain size, spread volume, and moisture content). The adhesive shear strength and wood failure of plywoods were measured in accordance with the Japanese Agricultural Standard (JAS) for plywood. The result showed that fine kenaf core powder played a role as an effective binder when plywoods were pressed at high pressure, which caused extreme compression of veneer cells. In addition, the adhesive shear strength of plywoods in dry conditions was high regardless of pressing temperature and time, but it was sensitive to pressing temperature and time in wet conditions. The highest adhesive shear strength was obtained from plywoods manufactured with kenaf core powder (grain size 10 μm, spread volume 200 g/m², moisture content 8.6%) under hot-pressing conditions (pressure 5.0 MPa using distance bars 4 mm thick, temperature 200°C, time 20–30 min). However, the plywood could not meet the requirement for the second grade of plywood by JAS because of its low water-resistance properties. Part of this article was presented at the 58th Annual Meeting of the Japan Wood Research Society, Tsukuba, March 2008, and the 10th World Conference on Timber Engineering, Miyazaki, June 2008     

Blowout conditions and properties of isocyanate resin bonded particleboard manufactured from high-moisture particles using an air-injection press

Blowouts of particleboards were artificially induced by increasing the vapor pressure inside the boards. Isocyanate resin bonded boards were manufactured from high-moisture particles, and the blowouts and board properties were analyzed. Boards with a high resin content of 5 % showed high bonding strength and did not blow out when pressed at 190 °C, but blew out at a raised temperature of 210 °C to increase vapor pressure inside the boards, thereby showing that blowout occurred when vapor pressure inside the boards exceeded the bonding strength of isocyanate resin. Boards with a low resin content of 2.5 % had low bonding strength and blew out when manufactured without air injection, but were successfully manufactured with air injection that prevents blowouts. However, the injection of high-pressure air reduced the strength properties of the board and increased the coefficient of variation, likely due to the discharge of isocyanate resin from the boards. Therefore, very small local blowouts occurred inside the boards, which lowered the strength properties of some specimens and led to a large coefficient of variation. When the pressure of injected air was lowered, the strength properties increased and the coefficient of variation decreased. This was possibly because the low-pressure air allowed isocyanate resin to remain in the boards, resulting in virtually no parts showing very low-strength properties.     

热压工艺对竹重组板材性能的影响

探讨了以竹材为主要原料的竹重组板材热压工艺的优化,研究了热压工艺对竹重组板材力学性能的影响,讨论分析了热压压力、热压时间、热压温度对竹重组板材吸水厚度膨胀率、耐沸水性、静曲强度、弹性模量、耐磨性、耐化学腐蚀性、浸渍剥离率和甲醛释放量等性能的影响。通过正交试验,得出的优化热压工艺为:①热压压力2.0MPa、热压温度145℃、热压时间1.7min/mm,热压压力对竹重组板材耐酸性、静曲强度和弹性模量等影响显著,对耐沸水性、耐碱性、耐盐性、耐磨性和浸渍剥离率等影响不显著。②热压时间对竹重组板材静曲强度有显著影响,对其他试验指标影响不显著。③热压温度对竹重组板材各试验检测指标均有一定的影响,但不显著。     

The effects of chemical components and particle size on the mechanical properties of binderless boards made from oak (<Emphasis Type="Italic">Quercus</Emphasis> spp.) logs degraded by shiitake fungi <Emphasis Type="Italic">(Lentinula edodes</Emphasis>)

Binderless boards are composite boards that rely on self-bonding mechanisms for inter-fibre bonding. Quercus acutissima and Quercus serrata logs degraded by Lentinula edodes (shiitake fungi) were used in this study to investigate whether physical and chemical changes induced by shiitake fungi can enhance board mechanical properties. Binderless boards were manufactured with 0.8 g/cm³ target density, 220 °C pressing temperature, 5 MPa pressure, and pressing duration of 10 min. Boards made from logs degraded for ≥?26 months were stronger than control boards and met modulus of rupture (MOR) and internal bonding (IB) requirements for fibreboards. Chemical composition and particle size distribution of the wood powder used to make the boards were determined to elucidate the drivers of board mechanical properties. The proportion of small particles (<?150 µm) showed a strong positive correlation with MOR for both species and hot water extractives showed a strong positive correlation with IB for Q. acutissima boards. Introduction of shiitake fungi pre-treatment to the production process may enhance the mechanical strength of binderless boards.     

Carbonization mechanism of bamboo（phyllostachys） by means of Fourier Transform Infrared and elemental analysis

Bamboo was carbonized at different temperatures ranging from 200℃ to 600℃.The dependence of the change of hemicellulose,cellulose,and lignin on the temperature was investigated by means of elemental analysis and Fourier Transform Infrared (FTIR) spectra of the residual solid products.The results showed:(1)Below 200℃,hemicellulose in bamboo wasdecomposed and a large amount of hydroxyl groups are dislocated from hemicellulose and cellulose,accompanied by the evolution of water to escape.(2)200℃-250℃,cellulose in bamboo was brastically decomposed whereas the net structure of lignin keep stable,with the except of the dislocation of methoxyl groups from lignin.(3)250℃-400℃,the net structure of lignin collapse,up to 400℃,followed by that the more position in aryl groups are substituted.(4)For bamboo carbonization,the aromatization of residual carbon has approximately completed at the temperature as high as 600℃.But the fusion of aromatic rings possibly does not occur.     

Effects of air injection on properties of particleboard manufactured using a radio-frequency hot press

The effectiveness of air injection for preventing the blowout of particleboards manufactured using a radio-frequency hot press was investigated by evaluating the board properties under artificially created conditions that were conducive to blowout. For evaluation, 10-mm-thick boards with densities of 0.7 and 0.8 g/cm³ and 20-mm-thick boards with a density of 0.7 g/cm³ were manufactured. Pressing times for the 10-mm-thick boards were 2, 4, 6, and 8 min, and those for the 20-mm-thick boards were 4, 6, 8, and 10 min. Without air injection, blowout occurred in all manufactured boards. With air injection, however, blowout did not occur in the 10-mm-thick boards with a density of 0.7 g/cm³. Moreover, air injection prevented blowout even when the board density and board thickness were increased to 0.8 g/cm³ (for 10-mm-thick boards) and 20 mm (the density was kept at 0.7 g/cm³), respectively. Air-injection radio-frequency pressing reduced the pressing time from 4 to 2 min for 10-mm-thick boards, and from 6 to 4 min for 20-mm-thick boards. Moreover, this reduction in the pressing time was achieved without a large reduction in the internal bond strength of the boards.     

Strength properties of thermally modified softwoods and its relation to polymeric structural wood constituents

Thermal modification at relatively high temperatures (ranging from 150 to 260 °C) is an effective method to improve the dimensional stability and resistance against fungal attack. This study was performed to investigate the impact of heat treatment on the mechanical properties of wood. An industrially-used two-stage heat treatment method under relative mild conditions (< 200 °C) was used to treat the boards. Heat treatment revealed a clear effect on the mechanical properties of softwood species. The tensile strength parallel to the grain showed a rather large decrease, whereas the compressive strength parallel to the fibre increased after heat treatment. The bending strength, which is a combination of the tensile stress, compressive stress and shear stress, was lower after heat treatment. This decrease was less than the decrease of only the tensile strength. The impact strength showed a rather large decrease after heat treatment. An increase of the modulus of elasticity during the bending test has been noticed after heat treatment. Changes and/or modifications of the main wood components appear to be involved in the effects of heat treatment on the mechanical properties. The possible effect of degradation and modification of hemicelluloses, degradation and/or crystallization of amorphous cellulose, and polycondensation reactions of lignin on the mechanical properties of heat treated wood have been discussed. The effect of natural defects, such as knots, resin pockets, abnormal slope of grain and reaction wood, on the strength properties of wood appeared to be affected by heat treatment. Nevertheless, heat treated timber shows potential for use in constructions, but it is important to carefully consider the stresses that occur in a construction and some practical consequences when heat treated timber is used.     

Effect of the addition of <Emphasis Type="Italic">Acacia mangium</Emphasis> bark on thermosetting of phenol–formaldehyde resin

The effect of addition of Acacia mangium bark powder on the thermosetting processes of two commercial phenol resins, PF-A and PF-B, was examined by bond strength test, torsional braid analysis, and differential scanning calorimetry. When the bark powder was added to PF-A, the bond strength of plywood pressed at 110°C increased and was comparable to that of plywood pressed at 120 and 130°C. However, when the bark powder was added to PF-B, the bond strength of plywood pressed at 110°C was still lower than that of plywood pressed at 120 and 130°C. The relative rigidity and loss tangent of PF-A cured with the bark powder obtained by heating at 100°C were comparable to those at 120 and 140°C, and the reaction enthalpy was increased by bark powder addition. In contrast, chemical reactions for cured PF-B were not enhanced by bark powder addition.